LED Packaging Frame with Integrated Reflectors
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Solution Overview
Problem
Conventional LED packaging devices require redesigning frames and the use of reflective materials, leading to high costs and reduced production rates, and lack flexibility for different LED chip sizes, which hampers their luminous efficacy and application flexibility.
Innovation Solution
An LED packaging device with a frame having a bottom wall and surrounding wall defining a mounting space, where LED chips are mounted, and spaced-apart reflectors are placed on the peripheral region of the bottom surface to shorten the light propagation distance and enhance light extraction efficiency, using materials like epoxy molding compound, polyphthalamide, or ceramic materials for the frame and reflective silica gel or white glue for the reflectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If reflective material is disposed around the sidewall of the cup hole of the frame to improve light extraction efficiency, then luminous efficacy is improved, but manufacturing cost increases and production rate decreases
Solution Approach 1:
The frame is pre-formed with integrated reflector structures during the molding process, so that the reflectors are already in position before LED chip mounting. This eliminates the need for separate reflector installation steps, improving production rate while maintaining light extraction efficiency
Solution Approach 2:
The reflector structures are merged with the frame body as a single integrated component. The frame and reflectors are formed from the same material (EPDM or PPA) in a single molding process, reducing manufacturing complexity and cost while maintaining optical performance
2Adaptability or versatility
If frame is redesigned to accommodate different LED chip sizes to improve application flexibility, then adaptability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The frame is designed with a universal mounting structure that can accommodate different LED chip sizes through adjustable positioning features. The cup hole and surrounding structures are dimensioned to accept various chip configurations without requiring frame redesign, enabling one frame design to serve multiple applications
Solution Approach 2:
The mounting structure is segmented into adjustable components that can be independently positioned. This allows the frame to adapt to different LED chip sizes by adjusting the position of mounting elements rather than redesigning the entire frame structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves light extraction efficiency by reducing the total propagation distance and differences in light propagation paths, thereby enhancing the luminous efficacy of LED devices without the need for frame redesign and increasing production flexibility.
Implementation Method 1
a plurality of spaced-apart reflectors... Each of the reflectors is disposed on a peripheral region of the bottom surface... to shorten the light propagation distance and enhance light extraction efficiency
Data Source
AI summary
An LED packaging device includes a frame including a bottom wall having a bottom surface and a surrounding wall extending upwardly from the bottom wall, at least one LED chip, a plurality of spaced-apart reflectors and a packaging body. The bottom and surrounding walls cooperatively define a mounting space. The surrounding wall has an internal side surface facing the mounting space and a top surface facing away from the bottom surface. The LED chip is disposed on the bottom surface and is received in the mounting space. Each of the reflectors is disposed on a peripheral region of the bottom surface. The packaging body covers the LED chip and the reflectors, such that the LED chip is sealed inside the mounting space.