LED Packaging Module With Encapsulated Chip Array and Shared Wiring
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Solution Overview
Problem
Current LED packaging technologies face challenges in achieving smaller LED package sizes while maintaining effective light emission and electrical connectivity.
Innovation Solution
The proposed LED packaging module incorporates a plurality of light-emitting units arranged in an array, each unit comprising three LED chips with a specific electrode assembly and wiring assembly that electrically connects the LED chips in parallel, allowing for a compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If LED package size is reduced to increase display resolution, then display resolution is improved, but it becomes difficult to maintain effective light emission and electrical connectivity
Solution Approach 1:
The patent divides a single LED package into multiple light-emitting units, each containing multiple LED chips arranged in an array. This segmentation allows the overall package to achieve high resolution through multiple smaller emitting elements while maintaining reliable electrical connectivity through shared wiring structures and encapsulation that protects all units simultaneously.
Solution Approach 2:
The patent combines multiple LED chips into integrated light-emitting units with shared wiring assemblies and common encapsulating layers. This merging approach reduces the overall package size while maintaining effective light emission through the collective output of multiple chips and ensures electrical connectivity through shared electrical connection structures.
2Volume of moving object
If multiple LED chips are arranged in a compact array to reduce package size, then package size is reduced, but optical crosstalk between adjacent chips may increase
Solution Approach 1:
The patent extracts and eliminates optical crosstalk through the encapsulating layer that surrounds each light-emitting unit and the wiring assembly structure that physically separates adjacent LED chips. This extraction of harmful optical interference allows compact arrangement of multiple chips while maintaining optical isolation between neighboring units.
Solution Approach 2:
The patent applies local quality by providing individual encapsulating layers for each light-emitting unit that specifically address optical crosstalk at localized positions between adjacent chips. This localized optical management allows compact packaging while preventing harmful light interference between neighboring LED chips through position-specific encapsulation structures.
3Volume of moving object
If LED chips are arranged in a dense array to achieve smaller package size, then package size is reduced, but wiring complexity increases
Solution Approach 1:
The patent applies universality by designing shared wiring assemblies that serve multiple light-emitting units simultaneously. The wiring structure is configured to provide electrical connections to multiple LED chips through common conductive paths and shared connection points, reducing overall wiring complexity while maintaining dense array arrangement of the LED chips.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the creation of smaller LED packages with improved light concentration and reduced optical crosstalk, enhancing display resolution and efficiency.
Implementation Method 1
light-emitting diodes (LEDs) are one of the most popular lighting technology
Data Source
AI summary
A light-emitting diode (LED) packaging module includes light-emitting units arranged in an array having m row(s) and n column(s), an encapsulating layer, and a wiring assembly, where m and n each independently represents a positive integer. Each of the light-emitting units includes LED chips each including a chip first surface, a chip second surface, a chip side surface, and an electrode assembly disposed on the chip second surface. The encapsulating layer covers the chip side surface and fills a space among the LED chips. The wiring assembly is disposed on the chip second surface and is electrically connected to the electrode assembly.