LED Packaging Structure for Thin RGB Displays and Low Crosstalk
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Solution Overview
Problem
The existing LED packaging technologies face challenges in achieving thinness and integration due to the thickness of RGB LEDs, which limits their application and results in inconsistent light color and reduced display quality, primarily because of the packaging thickness determined by substrates, solder paste, and wire bonding, leading to difficulties in manufacturing and high costs.
Innovation Solution
The proposed LED packaging module includes LED chips with a wiring layer and an encapsulant component, where the LED chips are spaced apart, and the encapsulant fills gaps among the wiring parts, allowing for a thinner design without soldering or wire bonding, and a light-transmitting layer adjusts the light output ratio by controlling the height differences of the chip surfaces and using light-absorbing materials to reduce optical crosstalk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If traditional substrate-based LED packaging with solder paste or wire bonding is used, then electrical connection and structural support are achieved, but packaging thickness increases beyond 500 μm
Solution Approach 1:
The patent removes the traditional substrate from the LED packaging structure, eliminating the need for solder paste or wire bonding. The LED chip is directly mounted on the packaging board with electrodes contacting the packaging board surface, extracting the substrate function while reducing thickness to below 500 μm.
Solution Approach 2:
Instead of mounting the LED chip face-up or face-down on a substrate with complex interconnections, the patent inverts the approach by having the chip electrodes directly contact the packaging board surface, simplifying the structure and reducing thickness.
2Manufacturing precision
If small-sized RGB LEDs are used to improve display resolution, then pixel density increases, but manufacturing precision requirements and costs increase
Solution Approach 1:
The patent eliminates the die bonding process entirely by removing the substrate, thereby eliminating the associated precision requirements and costs for die bonding while maintaining small-sized RGB LED benefits.
3Illumination intensity
If varying packaging surface treatment processes are applied, then different light output characteristics are achieved, but light color differences and mixing inconsistency increase
Solution Approach 1:
The patent applies different light-absorbing material layers to different regions of the packaging board beneath each LED chip, with each layer having specific optical properties tailored to that location to control light output and prevent color mixing while maintaining consistency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables a thinner, more integrated LED packaging module with improved display resolution and contrast by reducing packaging thickness, minimizing optical interference, and achieving desired light output ratios for RGB displays, thus enhancing the overall display quality.
Implementation Method 1
a light-absorbing material layer is formed on the packaging board
Implementation Method 2
The encapsulant component covers the LED chips and the wiring layer, and fills gaps among the LED chips and gaps among the wiring parts
Implementation Method 3
a light-transmitting layer covers the chip first surfaces of the LED chips
Data Source
AI summary
A light-emitting diode (LED) packaging module includes LED chips, a wiring layer, and an encapsulant component. Each of the LED chips includes a chip first surface, a chip second surface, a chip side surface, and an electrode unit. The wiring layer is disposed on the chip second surfaces of the LED chips, and contacts and is electrically connected to the electrode units. The encapsulant component includes a first encapsulating layer that covers the chip side surface, and a second encapsulating layer that covers the wiring layer. The LED chip has a thickness TA, the first encapsulating layer has a thickness TB, in which TB/TA≥1.