LED Module Pad Layout for Flexible Multi-Circuit Connections
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Solution Overview
Problem
Light emitting diode packages face design difficulties and inefficient space utilization due to the need for separate wires to connect multiple LEDs in series, parallel, or series-parallel configurations, which complicates circuit arrangement and reduces operational efficiency.
Innovation Solution
A light emitting apparatus with a base substrate featuring a pad pattern that allows for efficient electrode connections, including sub-pads for series and parallel configurations, integrated circuits for light management, and a reflector for improved light extraction, enabling flexible circuit arrangements and enhanced reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate wires are used to connect multiple LEDs in series, parallel, or series-parallel configurations, then the desired connection flexibility is achieved, but design difficulty increases and space utilization becomes inefficient
Solution Approach 1:
The pad structure is segmented into multiple sub-pads (first sub-pad, second sub-pad, third sub-pad, fourth sub-pad) that can be independently configured to create different connection patterns. This segmentation allows the same physical structure to support series, parallel, and series-parallel connections without requiring separate wire arrangements for each configuration.
Solution Approach 2:
The pad structure is designed with multi-functionality to serve multiple connection purposes. The same set of sub-pads can be used to achieve series connections (connecting first sub-pad to third sub-pad, second sub-pad to fourth sub-pad), parallel connections (connecting first sub-pad to second sub-pad, third sub-pad to fourth sub-pad), or series-parallel combinations, eliminating the need for different wire layouts for different connection types.
2Adaptability or versatility
If separate wires are used to connect multiple LEDs, then connection flexibility is achieved, but space utilization in the package becomes inefficient
Solution Approach 1:
The invention merges the functions of multiple separate wire connections into a single integrated pad structure. Instead of using separate wires to achieve series, parallel, or series-parallel connections, all connection functions are combined into one pad structure with multiple sub-pads, significantly reducing the space required for connections and improving overall space utilization in the LED package.
Solution Approach 2:
The invention transitions from a two-dimensional wire layout approach to a three-dimensional pad structure approach. By stacking sub-pads in different layers and using vertical connections, the design achieves complex connection patterns without requiring proportional increases in horizontal space, thereby improving space utilization while maintaining connection flexibility.
3Ease of manufacture
If circuits are exposed to external environment, then manufacturing simplicity is maintained, but reliability decreases due to lack of protection
Solution Approach 1:
The circuit is nested within a protective housing structure that encloses the pad and circuit components. This nested configuration protects the sensitive circuit elements from external environmental factors such as moisture, dust, and physical damage, while the housing itself is designed to be compact and integrated with the overall LED package structure, maintaining manufacturing simplicity.
Data Source
AI summary
A light emitting apparatus is disclosed. The light emitting apparatus includes: a plurality of circuits disposed on a base substrate; one or more light emitting sources in at least a circuit among the plurality of circuits; and a pad disposed under the base substrate and contacting one electrode and another electrode of each of the plurality of circuits. The pad includes: a first sub-pad contacting one electrode of a first circuit among the plurality of circuits, a third sub-pad contacting another electrode of the first circuit, a second sub-pad contacting one electrode of a second circuit among the plurality of circuits, and a fourth sub-pad contacting another electrode of the second circuit, and at least a region of one surface of the second sub-pad is disposed to face at least a region of one surface of the third sub-pad.