LED Pad Electrode Layout for Multi-Element Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing light-emitting devices face complexity in controlling multiple light-emitting elements without increasing the complexity of the interconnect structure of the substrate.
Innovation Solution
A light-emitting device configuration with a substrate and n+1 interconnects allows for individual control of n light-emitting elements, where each element has a specific semiconductor layer structure and bonding members connected to interconnects, enabling series connection and independent light emission control with a simplified interconnect structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple light-emitting elements are mounted on the substrate, then the light emission capability is improved, but the interconnect structure complexity increases
Solution Approach 1:
Multiple light-emitting elements are electrically connected in series through a shared interconnect structure. The second bonding member of the first light-emitting element and the first bonding member of the second light-emitting element are both bonded to the second interconnect, merging multiple electrical connections into a single shared path, thereby reducing overall interconnect complexity while maintaining individual controllability
Solution Approach 2:
The interconnect structure is segmented into distinct regions: external connection portions are positioned between the first side and the first light-emitting element, while bonding members are positioned between the first light-emitting element and the second side. This spatial segmentation allows for simplified routing and reduced complexity in the interconnect layout
2Ease of operation
If n light-emitting elements are controlled individually, then the control precision is improved, but the number of interconnects increases to n+1
Solution Approach 1:
Each interconnect serves multiple functions: the second interconnect simultaneously receives the second bonding member from the first light-emitting element and the first bonding member from the second light-emitting element. This multi-functional design allows n light-emitting elements to be individually controlled using only n+1 interconnects rather than requiring separate dedicated interconnects for each element
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables individual and simultaneous control of multiple light-emitting elements with a reduced and simplified interconnect structure, improving light emission efficiency and allowing for a denser, more uniform light-emitting region with enhanced heat dissipation.
Implementation Method 1
a light-emitting layer provided between the first semiconductor layer and the second semiconductor layer
Data Source
AI summary
A light-emitting element includes: a support substrate; a semiconductor stacked body disposed on the support substrate, the semiconductor stacked body including a first semiconductor layer, a second semiconductor layer, and a light-emitting layer provided between the first semiconductor layer and the second semiconductor layer; an insulating film including a first opening disposed above the first semiconductor layer and a plurality of second openings disposed above the second semiconductor layer; a first pad electrode disposed on the insulating film and electrically connected to the first semiconductor layer at the first opening; a second pad electrode disposed on the insulating film and electrically connected to the second semiconductor layer at the plurality of second openings; and a third pad electrode disposed on the insulating film and electrically insulated from the semiconductor stacked body.