LED Display Panel Adhesive Switching for Chip Repair
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Solution Overview
Problem
Conventional mini-scale LED display products face challenges in repairing processes due to the complexity and low yield rate, often resulting in damaged LED chips and poor display quality, especially when using high-power lasers for removing and rewelding defective chips.
Innovation Solution
A display panel design featuring an adhesive with a first and second state, where the adhesive's viscosity is reduced by low-power laser irradiation, allowing for secure attachment and easy repair of LED chips without damaging them, eliminating the need for solder and enhancing the stability of electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If high-power laser is used to remove and reweld defective LED chips, then LED chips can be removed and replaced, but LED chips are easy to be damaged by high-power laser, reducing repairing yield rate and display quality
Solution Approach 1:
The patent changes the physical state of the adhesive through temperature control. During repair, the adhesive is heated to a high-temperature state where it becomes fluid, allowing easy removal of defective LEDs. After repair, the adhesive returns to a low-temperature solid state, providing strong bonding. This parameter change enables repair without damaging LEDs, as the controlled thermal cycle doesn't expose the LEDs to the extreme temperatures of high-power laser welding.
2Strength
If solder paste is used to fix LED chips to driving backplate, then strong electrical connection is achieved, but repairing processes become complicated and yield rate decreases
Solution Approach 1:
The patent replaces the mechanical welding process (solder paste and high-power laser welding) with a thermal-state-controlled adhesive system. The adhesive provides electrical connection through its conductive properties in both solid and fluid states, eliminating the need for complex welding equipment and processes. Repair becomes simpler as it only requires controlled heating to change the adhesive's state, rather than complex soldering and welding operations.
3Manufacturing precision
If mini-scale LEDs are used to reduce display pixel size, then display resolution is improved, but manufacturing processes become difficult and yield rate cannot achieve expectations
Solution Approach 1:
The patent uses temperature parameter changes to control the adhesive's viscosity and bonding characteristics. During manufacturing, the adhesive can be heated to a fluid state for easy placement and alignment of mini-scale LEDs, then cooled to solidify and secure them. This thermal control enables precise positioning and secure attachment of small LEDs without the complexity of traditional welding processes, improving both manufacturing precision and yield rate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves the yield rate and display quality by enabling efficient and non-damaging repair of LED chips, reducing the risk of low brightness or failure, and simplifying the repair process while maintaining the stability of electrical connections.
Implementation Method 1
the adhesive is converted from the first state into the second state by laser irradiation
Implementation Method 2
viscosity of the adhesive in the second state is less than viscosity of the adhesive in the first state, and the driving backplate and the LED chips are fixedly connected to each other by the adhesive in the first state
Implementation Method 3
the adhesive is converted from the second state into the first state by laser irradiation
Implementation Method 4
the adhesive is converted from the second state into the first state by laser irradiation, and power of a laser is less than 10 w
Data Source
AI summary
A display panel and a display device are provided. The display panel includes a driving backplate, a plurality of light-emitting diode (LED) chips disposed on a side of the driving backplate, and an adhesive. The adhesive includes a first state and a second state. Viscosity of the adhesive in the second state is less than viscosity of the adhesive in the first state. The driving backplate and the LED chips are fixedly connected to each other by the adhesive in the first state. The adhesive can be converted from the first state into the second state by laser irradiation, and power of the laser is less than 10 w. The driving backplate and the LED chips are attached to each other by the adhesive in the first state, and viscosity of the adhesive in the first state can be reduced by irradiation with a low-power laser.