LED Panel Bonding Structure for Mixed-Height RGB LEDs
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Solution Overview
Problem
The manufacturing of LED panels faces issues due to thickness differences between red (R), green (G), and blue (B) LEDs, leading to potential breakage or unbonding during the bonding process on a TFT backplane, as the existing method forms LED bonding areas at the same height regardless of LED type, causing interference and cracking.
Innovation Solution
The LED bonding areas on the TFT backplane are formed at different heights based on the type of LED, with the thinnest LED being bonded to the lowest height area, and an additional organic film is formed between pixel electrodes to minimize interference and ensure proper bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If all LED bonding areas are formed at the same height on the TFT backplane, then the manufacturing process is simplified, but thinner LEDs may be broken or unbonded during subsequent bonding processes
Solution Approach 1:
The patent applies local quality by forming different organic film thicknesses at different LED bonding areas corresponding to different LED types. Specifically, thinner organic films are formed at areas for thinner LEDs (e.g., red LEDs) while thicker organic films are formed at areas for thicker LEDs (e.g., green and blue LEDs). This localized variation in organic film thickness compensates for the thickness differences among LEDs, ensuring that each LED bonds reliably without being broken or unbonded during the bonding process.
2Reliability
If the stamper pressure is increased to bond thinner LEDs, then bonding reliability improves, but the thinner LEDs may be broken into pieces
Solution Approach 1:
The patent applies parameter changes by varying the organic film thickness parameter at different LED bonding areas. By controlling the organic film thickness to be thinner at areas for thinner LEDs and thicker at areas for thicker LEDs, the patent creates different bonding conditions for different LED types. This allows the bonding process to accommodate thickness variations without requiring excessive stamper pressure, thereby preventing LED breakage while ensuring reliable bonding.
3Reliability
If sequential bonding of different LED types is performed, then thickness differences can be accommodated, but the process time increases and interference occurs
Solution Approach 1:
The patent applies preliminary action by pre-forming organic films of different thicknesses at each LED bonding area before the LED bonding process. This preliminary preparation of varied organic film thicknesses enables all LEDs of different types to be bonded simultaneously in a single stamper pressing operation, rather than requiring sequential bonding. The preliminary action eliminates interference between LEDs of different thicknesses and reduces manufacturing cycle time.
Data Source
AI summary
A light emitting diode (LED) panel is provided. The LED panel includes a thin-film transistor (TFT) backplane which includes an insulator film disposed on a top surface of a substrate, a plurality of organic films disposed on a top surface of the insulator film, and pixel electrodes disposed on a top surface of each of the plurality of organic films. The LED panel further includes a plurality of LEDs respectively bonded to the pixel electrodes disposed on the top surface of each of the plurality of organic films, wherein the plurality of organic films has the different heights according to a type of each of the plurality of LEDs respectively bonded to the pixel electrodes disposed on the top surface of each of the plurality of organic films.