LED Packaging Paraboloid Sideways Light Emission
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Solution Overview
Problem
Conventional LED packaging arrangements result in a substantial portion of light output being emitted parallel to the normal of the semiconductor photonic chip, limiting flexibility in light emission patterns and requiring improved thermal dissipation and manufacturing efficiency.
Innovation Solution
An LED packaging arrangement featuring a semiconductor photonic chip mounted on a substrate with a transparent medium having a paraboloid top surface and a mirrored surface, where the focal point of the paraboloid is centered at the chip, redirecting a significant portion of light emission sideways, allowing for adjustable emission angles and enhanced thermal dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional LED packaging arrangement with a lens is used, then the light emission pattern is focused along the normal direction, but the flexibility in adjusting light emission patterns is limited
Solution Approach 1:
The patent changes the geometric parameter of the transparent medium from a conventional lens shape to a paraboloid shape. This parameter change fundamentally alters the light emission pattern from focused (along the normal) to directional (sideways), providing flexibility in adjusting light emission patterns while maintaining a simple packaging structure with fewer components
2Illumination intensity
If a reflective cup is added to direct more light into a useable cone angle, then light directionality is improved, but the number of parts and manufacturing complexity increases
Solution Approach 1:
The patent merges the functions of the transparent medium and the reflective surface into a single integrated component. The paraboloid-shaped transparent medium with its mirrored surface combines light redirection and reflection functions that would traditionally require separate components (lens plus reflective cup), thereby improving light directionality while reducing the number of parts and manufacturing complexity
3Temperature
If light is emitted primarily along the normal direction, then the LED packaging is simple, but thermal dissipation performance is insufficient
Solution Approach 1:
The patent changes the light emission dimension from primarily vertical (along the normal) to primarily horizontal (sideways). This dimensional change in light emission pattern allows for improved thermal dissipation pathways while maintaining manufacturing simplicity, as the paraboloid shape can be formed in a single molding process without requiring complex assembly steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a substantial portion of light to be emitted in directions other than normal to the photonic chip, improving thermal dissipation and manufacturing ease while allowing for adjustable light emission patterns, enhancing the versatility and efficiency of LED lighting products.
Implementation Method 1
a mirrored surface substantially mating with said paraboloid top surface
Implementation Method 2
a transparent medium having a substantially paraboloid top surface having a focal point, the transparent medium also having a recess to receive the semiconductor photonic chip
Data Source
AI summary
Sideways emission enhancements are described for light emitting diode (LED) lighting solutions having a wide variety of applications. While a typical LED lighting device has a substantial portion of its light emitted near a normal to the semiconductor photonic chip emitting the light, the present approach may suitable provide a compact, easily manufacturable device with good thermal design characteristics and a changed emission pattern without changing the horizontal mounting plane of the semiconductor photonic chip.