LED Chip Thermal Management via Patterned Conductive Layer
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Solution Overview
Problem
High-power and high-current LEDs face performance degradation due to overheating, which can lead to malfunction, and existing solutions do not effectively enhance both light emitting efficiency and heat dissipation.
Innovation Solution
An electronic device with an insulating substrate and a patterned conductive layer is used, where the chip is electrically connected to an external circuit via the patterned conductive layer, allowing heat generated by the chip to be transferred to external surroundings through the patterned conductive layer and insulating substrate, enhancing heat dissipation and maintaining light emitting efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the power and working current of LEDs are increased to improve luminance, then the light emitting efficiency and brightness are improved, but the heat generation increases causing performance degradation and malfunction
Solution Approach 1:
The patent segments the substrate into distinct functional zones: an insulating substrate for electrical isolation and a separate heat dissipation substrate for thermal management. This segmentation allows independent optimization of electrical and thermal pathways, enabling high-power operation without thermal degradation while maintaining high luminance output.
Solution Approach 2:
The patent introduces a patterned conductive layer as an intermediary between the LED chip and the substrates. This conductive layer serves dual functions: providing electrical connection for high current operation and acting as a thermal pathway to conduct heat away from the chip, thus enabling both high luminance and effective heat management.
2Ease of manufacture
If traditional packaging structures are used for high-power LEDs, then manufacturing is simpler, but heat dissipation capability is insufficient leading to overheat and malfunction
Solution Approach 1:
The patent employs a composite substrate structure combining an insulating substrate (such as ceramic or glass) with a heat dissipation substrate (such as metal). This composite structure leverages the electrical insulation properties of the first material and the high thermal conductivity of the second material, achieving both manufacturing feasibility and superior heat dissipation for reliable high-power LED operation.
Solution Approach 2:
The patent transitions from a single-layer substrate to a multi-layer substrate architecture. This dimensional change enables simultaneous achievement of electrical isolation and thermal conduction by stacking materials with different properties, thereby improving heat dissipation capability while maintaining ease of manufacture through standardized layering processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves effective heat dissipation, improving the overall performance of the LED by allowing direct heat transfer and maintaining light emitting efficiency, thus addressing the overheating issues in high-power LEDs.
Implementation Method 1
heat generated by the chip is transferred to external surroundings via the patterned conductive layer and the insulating substrate
Implementation Method 2
a specific heat of the insulating substrate is higher than 650 J/Kg-K
Implementation Method 3
a coefficient of thermal conductivity of the insulating substrate is greater than 10 W/m-K
Data Source
AI summary
An electronic device including an insulating substrate, a chip and a patterned conductive layer is provided. The insulating substrate has an upper surface and a lower surface opposite to each other. The chip is disposed above the upper surface of the insulating substrate. The patterned conductive layer is disposed between the upper surface of the insulating substrate and the chip. The chip is electrically connected to an external circuit via the patterned conductive layer. Heat generated by the chip is transferred to external surroundings via the patterned conductive layer and the insulating substrate.