LED Phosphor Heat-Sinking Structure Against Thermal Quenching
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional LED devices face efficiency issues due to thermal quenching, where heat generated during operation reduces the color fidelity of white light emission, as the converter material's low thermal conductivity fails to adequately dissipate heat, leading to off-white appearances in electronic devices.
Innovation Solution
The introduction of a conduction material with high thermal conductivity, positioned between the insulating material and the converter material, efficiently conducts heat away from both the LED die and the converter material to the substrate, reducing thermal quenching by enhancing heat dissipation and maintaining color fidelity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If converter material is deposited on LED die to generate white light, then color fidelity is improved, but thermal quenching increases due to low thermal conductivity of converter material
Solution Approach 1:
A conduction material layer with high thermal conductivity is introduced between the converter material and the LED die. This intermediary layer serves as a thermal bridge that conducts heat away from the converter material to the LED die and substrate, reducing thermal quenching while preserving the color fidelity benefits of the converter material.
Solution Approach 2:
The thermal conductivity parameter of the material layer between converter material and substrate is changed from low (conventional structure) to high (conduction material). This parameter change enables efficient heat dissipation from the converter material, mitigating thermal quenching effects while maintaining the white light generation function.
2Device complexity
If conventional LED structure is used, then device complexity is reduced, but heat dissipation efficiency deteriorates
Solution Approach 1:
A conduction material layer is introduced as an intermediary between the converter material and the LED die/substrate. This additional layer improves heat dissipation efficiency by providing a high thermal conductivity pathway, while adding minimal structural complexity compared to the functional benefits achieved.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces thermal quenching, ensuring consistent white light emission and improved color fidelity by efficiently dissipating heat generated by both the LED die and the converter material, thereby maintaining the color accuracy of SSL devices.
Implementation Method 1
a conduction material with high thermal conductivity, positioned between the insulating material and the converter material, efficiently conducts heat away from both the LED die and the converter material to the substrate
Implementation Method 2
the InGaN material 16 of the LED die 4 emits a blue light that stimulates the converter material 6 to emit a light (e.g., a yellow light) at a desired frequency
Data Source
AI summary
Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.