LED Phosphor Coating via Screen Printing Template
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Solution Overview
Problem
The existing phosphor coating methods for white light emitting diodes (WLEDs) face issues with uneven coating due to gravity and surface tension, leading to photochromic unevenness, reduced yield, and material waste, as well as potential electric leakage and light absorption from scrap irons during screen printing.
Innovation Solution
A new phosphor conformal coating method using a screen printing process with a protection layer, where the phosphor is mixed with gel and coated evenly on the LED chip, allowing for recycling of excess phosphor without pollution, ensuring even light emission and reducing material waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional phosphor dispensing process is used, then the process is simple, but the phosphor coating is uneven due to gravity and surface tension, leading to photochromic unevenness
Solution Approach 1:
The patent replaces the traditional mechanical dispensing process with a screen printing process. The screen printing template with precise openings allows phosphor gel to be deposited uniformly through mechanical pressure and squeegee action, eliminating the influence of gravity and surface tension that cause uneven coating in dispensing methods.
Solution Approach 2:
The patent changes the physical state and delivery method of phosphor from loose particles to a gel formulation. The phosphor gel has controlled viscosity and adhesion properties that enable it to be printed uniformly through screen printing, achieving consistent coating thickness and distribution that cannot be obtained through traditional dispensing.
2Manufacturing precision
If screen printing is used for phosphor coating, then the phosphor layer thickness can be controlled, but scrap irons pollute the phosphor, causing electric leakage and light absorption
Solution Approach 1:
The patent extracts and removes scrap irons from the phosphor gel mixture before the screen printing process. By eliminating these harmful particles in advance, the phosphor gel becomes clean and suitable for precise screen printing, achieving both good thickness control and freedom from pollution-related defects.
Solution Approach 2:
The patent performs preliminary cleaning and filtration of the phosphor gel to remove scrap irons before the actual screen printing process. This preliminary action prevents contamination during coating, ensuring that the phosphor layer is free from particles that would cause electric leakage or light absorption issues.
3Manufacturing precision
If screen printing is used for phosphor coating, then the coating evenness is improved, but the process complexity increases due to template mounting and removal
Solution Approach 1:
The patent implements a systematic process for removing and recovering the screen printing template after phosphor deposition. The template is carefully removed from the LED chip surface, and any residual phosphor is recovered and recycled. This approach maintains the coating evenness benefits of screen printing while managing the process complexity through standardized template handling procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves improved light evenness, reduced material waste, and enhanced control over phosphor layer thickness, while preventing electric leakage and light absorption issues, thus increasing the luminous efficiency and yield of WLEDs.
Implementation Method 1
printing the phosphor over the chip surface via silk screen printing process
Implementation Method 2
baking the phosphor for curing
Data Source
AI summary
A fabrication method for a light emitting diode (LED), including: 1) mounting a LED chip on a substrate; 2) mounting a screen printing template on the LED chip; 3) coating a silicone gel layer over the surface of the screen printing template; 4) printing the phosphor: printing the phosphor over the chip surface via silk screen printing process and recycling the excess phosphor; and 5) removing the screen printing template and baking the phosphor for curing, and coating the cured phosphor over the chip surface. In the packaging method of the present disclosure, the unused phosphor can be recycled because it is not polluted by the screen printing template material.


