Multi-Color LED Pixel Arrays via Low-Temperature Bonding
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Solution Overview
Problem
The manufacturing complexity of LED arrays is high due to the need for large supporting substrates with I/O pads and high power consumption of driver circuitry, which reduces assembly yield and increases manufacturing costs.
Innovation Solution
The method involves forming different color light-emitting structures in sequential planar layers on a backplane device, using low temperature bonding and plug vias to simplify the manufacturing process and improve efficiency, allowing for the integration of multi-color light-emitting pixel arrays with reduced substrate size and lower power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If LED arrays are manufactured by depositing materials on a supporting substrate with I/O pads, then the array can be formed, but the supporting substrate size becomes larger than the array size, reducing assembly yield
Solution Approach 1:
The patent divides the LED array manufacturing into separate components: the LED array itself and the driver circuitry are fabricated on different substrates. This segmentation allows each component to be optimized independently, enabling smaller substrate sizes and higher assembly yields while eliminating the need for large supporting substrates with extensive I/O pads.
Solution Approach 2:
The patent integrates the driver circuitry within the same substrate as the LED array by forming transistor structures underneath or around the LED pixels. This nesting approach eliminates the need for separate driver circuits on additional substrates, reducing the overall substrate size required while maintaining full functionality.
2Ease of operation
If driver circuitry is added to control LED arrays, then the arrays can be addressed, but power consumption increases and manufacturing complexity increases
Solution Approach 1:
The patent merges the driver circuitry and LED array onto a single substrate, integrating the control functions directly with the light-emitting elements. This combination reduces the overall power consumption by eliminating interface losses and allows for optimized power distribution. The transistor structures are formed using the same semiconductor layers as the LEDs, creating a unified low-power system.
3Ease of operation
If driver circuitry is added to control LED arrays, then the arrays can be addressed, but manufacturing complexity increases
Solution Approach 1:
The patent segments the manufacturing process into distinct stages: first forming the semiconductor layers and transistor structures, then selectively removing portions to create isolated LED pixels, and finally integrating the driver circuitry. This segmented approach simplifies each individual manufacturing step compared to attempting to fabricate both drivers and LEDs simultaneously on the same substrate using conventional methods.
Solution Approach 2:
The patent changes the manufacturing parameters by using standard semiconductor fabrication techniques (deposition, etching, doping) to create both the driver transistors and LED structures from the same material layers. This parameter change allows a single manufacturing process to produce both functional elements, reducing overall manufacturing complexity compared to separate fabrication and assembly processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, improves yield, and reduces power consumption, resulting in more efficient and cost-effective production of multi-color light-emitting pixel arrays for display devices.
Implementation Method 1
each of the first light emitting elements is operable to emit light with a first color and conductively coupled to a respective pixel circuit
Data Source
AI summary
Integrated active-matrix multi-color light emitting pixel arrays based displays and methods of fabricating the integrated displays are provided. An example integrated device includes a backplane device and different color light emitting diodes (LEDs) devices arranged in different height planar layers on the backplane device. The backplane device includes at least one backplane having a number of pixel circuits. Each LED device includes an array of LEDs each operable to emit light with a particular color and conductively coupled to respective pixel circuits in the backplane to form active-matrix LED sub-pixels. The different color LED sub-pixels form an array of active-matrix multi-color display pixels. Plug vias can be arranged in different planar layers to conductively couple upper-level LEDs to respective pixel circuits in respective regions over the backplane device. The plug vias can extend from an upper planar layer into a lower planar layer to fix the two planar layers together.