LED Pixel Array Bonding Structure for Uniform Display Emission

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Solution Overview

Problem

Existing display devices with LEDs face challenges in achieving uniform light emission across their entire area, which affects display quality and efficiency.

Innovation Solution

The proposed display device includes a support substrate, a driving circuit substrate with a semiconductor substrate and transistors, and a pixel array device with LED cells. The pixel array device is disposed on the driving circuit substrate, and both are bonded using bonding electrodes and insulating layers, ensuring uniform light emission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a separate backlight is used in LCD display devices, then the display can be achieved, but the device size increases and light efficiency decreases

Engineering Contradiction:
Improvelight efficiencyVSAvoiddevice size
Core Design Contradiction:
ProductivityVSVolume of moving object

Solution Approach 1:

The patent extracts the backlight unit from the display structure by using self-emissive LED pixels that generate their own light, eliminating the need for a separate backlight component. This extraction principle directly resolves the contradiction by removing the bulky backlight while maintaining display functionality, thereby improving light efficiency and reducing device size.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the light generation function into the pixel structure itself by using LED cells that emit light directly. Instead of having a separate backlight unit, the display panel integrates light-emitting elements at the pixel level, combining the functions of light generation and image formation into a single structure, thus reducing overall device volume and improving light efficiency.

Inventive Principle:
Principle #5Merging (Combining)

2Volume of moving object

If miniaturization is achieved using LED pixels, then device size reduces, but uniform light emission across the display area becomes difficult to achieve

Engineering Contradiction:
Improvedevice sizeVSAvoiduniform light emission
Core Design Contradiction:
Volume of moving objectVSManufacturing precision

Solution Approach 1:

The patent applies local quality by optimizing the LED cell structure and arrangement at the pixel level to ensure uniform light emission characteristics across the entire display area. By carefully designing the local properties of each pixel (such as LED cell size, spacing, and orientation) and ensuring consistent manufacturing tolerances, the patent achieves uniform overall emission despite the miniaturized scale of individual pixels.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent utilizes parameter changes by adjusting key geometric and optical parameters of the LED cells and their arrangement to achieve uniform light emission. This includes optimizing parameters such as LED cell size, pitch, orientation angles, and encapsulation layer thickness to compensate for variations and ensure consistent luminance across the miniaturized display area.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If multiple bonding layers and electrodes are used to connect driving circuit and pixel array, then connection reliability improves, but device complexity increases

Engineering Contradiction:
Improveconnection reliabilityVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent segments the bonding structure into distinct functional layers (first bonding insulating layer with first bonding electrodes, second bonding insulating layer with second bonding electrodes) to achieve reliable electrical connections between the driving circuit substrate and pixel array substrate. This segmentation allows for organized signal routing and improved connection reliability while managing complexity through systematic layering.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent resolves complexity by transitioning to a multi-layer vertical bonding structure rather than attempting complex planar connections. By stacking bonding insulating layers and electrodes in the vertical dimension, the patent achieves reliable multi-point electrical connections between substrates while maintaining a relatively simple overall fabrication process and reducing lateral complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables excellent uniform light emission over the entire display area, improving display quality and efficiency compared to traditional LCDs.

Implementation Method 1

first bonding electrodes disposed in the first bonding insulating layer and electrically connected to the driving circuit

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

Each of the plurality of LED cells includes a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer between the first and second conductivity-type semiconductor layers

Methodology Applied
Scientific EffectLight-emitting diode effect: Light Emitting Diode

Data Source

PatentUS20250174618A1Display apparatus and fabrication method of the same
Publication Date: 2025.05.29 SAMSUNG ELECTRONICS CO LTD
  • US20250174618A1 patent drawing
  • US20250174618A1 patent drawing
  • US20250174618A1 patent drawing

AI summary

A display device is provided, the display device including: a support substrate occupying a first area; a driving circuit substrate occupying a second area larger than the first area and including a driving circuit; and a pixel array device occupying a third area larger than the second area, disposed on the driving circuit substrate, wherein the driving circuit substrate includes a first interconnection structure having a first bonding insulating layer and first bonding electrodes in the first bonding insulating layer, wherein the pixel array device includes a plurality of LED cells, an intermediate connection structure including an intermediate insulating layer partially covering the plurality of LED cells, and a second interconnection structure including a second bonding insulating layer bonded to the first bonding insulating layer, and second bonding electrodes in the second bonding insulating layer and respectively bonded to the first bonding electrodes.