LED Pixel Structure With Common Conductor for Dense Displays
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Solution Overview
Problem
Current pixel structures for display devices using LEDs face challenges in achieving high pixel density and efficient light emission due to the size and complexity of conventional packaging technologies, particularly with the use of conductive pillars which are expensive and time-consuming to manufacture.
Innovation Solution
A pixel structure incorporating a common conductive structure with a conductive portion that covers the semiconductor stack but does not emit light, allowing for a more compact and cost-effective design by eliminating the need for conductive pillars, and utilizing a dielectric layer to isolate mechanical impacts and improve reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging technology with conductive pillars is used, then electrical connection is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent removes the conductive pillar component from the packaging structure, replacing it with a direct bonding wire connection between the LED chip electrode and the circuit board. This extraction of the unnecessary conductive pillar simplifies the manufacturing process while maintaining reliable electrical connection through the bonding wire.
Solution Approach 2:
The bonding wire serves multiple functions: it provides electrical connection between the LED chip and circuit board, acts as a structural support element, and eliminates the need for separate conductive pillars. This multi-functionality reduces overall device complexity while maintaining connection reliability.
2Strength
If conventional packaging technology is used, then structural support is provided, but manufacturing time increases
Solution Approach 1:
The patent eliminates the conductive pillar structure that requires complex assembly steps, replacing it with a direct bonding wire approach. This reduction in structural components decreases the number of manufacturing steps and reduces overall manufacturing time while maintaining adequate structural support through the bonding wire and chip mounting structure.
Solution Approach 2:
The patent discards the unnecessary conductive pillar structure that adds manufacturing complexity and time. By removing this redundant component, the manufacturing process becomes more efficient without compromising the essential structural support needed for the LED package.
3Quantity of substance
If vertical type LED is used, then pixel density is improved, but light emission efficiency decreases
Solution Approach 1:
The patent positions the light-emitting surface of the vertical LED to extend toward the bonding wire direction, utilizing the vertical dimension more effectively. This dimensional optimization allows the compact vertical LED structure to maintain high pixel density while improving light extraction efficiency by directing more light toward the observation plane rather than being trapped in the vertical structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a more compact, cost-effective, and reliable pixel structure with improved light emission efficiency by reducing manufacturing complexity and eliminating the need for conductive pillars, while maintaining high pixel density and efficient light emission.
Implementation Method 1
The dielectric layer surrounds and contacts the first light-emitting diode and the second light-emitting diode
Implementation Method 2
The light-transmissive conductive layer covers and electrical connects the first light-emitting diode, the second light-emitting diode, and the common conductive structure
Implementation Method 3
The first light-emitting diode is used for emitting a first light, and has a first semiconductor layer, a first light-emitting surface, and a first electrode
Implementation Method 4
Light-Emitting Diode (LED) is a monochromatic light semiconductor element
Data Source
AI summary
A pixel structure includes a first light-emitting diode for emitting a first light, wherein the first light-emitting diode has a first semiconductor layer, a first light-emitting surface, and a first electrode under the first semiconductor layer away from the first light-emitting surface; a second light-emitting diode for emitting a second light, wherein the second light-emitting diode has a second semiconductor layer, a second light-emitting surface, and a second electrode under the second semiconductor layer away from the second light-emitting surface; a dielectric layer surrounding and contacting the first semiconductor layer and the second light-emitting diode and exposing the first light-emitting surface, the first electrode, the second light-emitting surface and the second electrode; a common conductive structure having a semiconductor layer and a metal layer; and a light-transmitting conductive layer covering and electrical connecting the first light-emitting diode, the second light-emitting diode and the common conductive structure.