LED Electrode Structure With Polymer Etching and Metal Protrusion
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Solution Overview
Problem
Traditional display manufacturing processes for micro and mini light-emitting diode displays are complex and costly, with multiple steps required for producing displays, which can be simplified to reduce costs and enhance efficiency.
Innovation Solution
A device with a light-emitting diode structure that includes a substrate, conductive pads, a metal protrusion, a polymer layer, and a top electrode, where the polymer layer covers the components and is etched to expose the top surface of the semiconductor layers and metal protrusion in one step, eliminating the need for forming openings and reducing manufacturing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional multi-step manufacturing process is used, then manufacturing precision can be maintained, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines multiple manufacturing steps into a single integrated process. The polymer layer is designed to simultaneously cover and protect multiple components (substrate, conductive pads, light-emitting diode, and metal protrusion) while enabling electrical connection through one etching step, eliminating the need for separate masking and etching operations for each component.
Solution Approach 2:
The polymer layer serves multiple functions: it acts as a protective covering for the light-emitting diode, provides electrical insulation between components, and serves as a mask layer that enables subsequent etching to expose both the metal protrusion and conductive pad simultaneously. This multi-functionality reduces the number of separate process steps required.
2Manufacturing precision
If multiple manufacturing steps are used, then manufacturing precision can be maintained, but productivity decreases
Solution Approach 1:
The metal protrusion is pre-formed on the second conductive pad before the polymer layer is applied. This preliminary action ensures that when the polymer layer is subsequently etched, the metal protrusion is already in position to establish electrical connection, eliminating the need for separate alignment and positioning steps during final assembly.
Solution Approach 2:
The patent merges the functions of multiple process steps into a single etching operation that simultaneously exposes the metal protrusion and creates the necessary electrical connections, thereby reducing the total number of manufacturing steps and improving productivity.
3Reliability
If polymer layer thickness is increased for better coverage, then protection and insulation improve, but additional etching steps are required
Solution Approach 1:
The polymer layer is applied with varying local thicknesses tailored to specific requirements: thicker regions provide enhanced protection and insulation over the light-emitting diode and conductive pads, while thinner regions are maintained in areas where electrical connection is needed. This localized quality optimization ensures adequate insulation without requiring excessive overall thickness.
Solution Approach 2:
The patent optimizes the polymer layer thickness parameter to achieve the minimum required insulation and protection levels. By carefully controlling the thickness parameter, the design ensures adequate electrical insulation and mechanical protection while allowing the etching process to expose the metal protrusion and conductive pad in a single step, avoiding the need for multiple etching operations.
Data Source
AI summary
A device with a light-emitting diode includes a substrate, a first conductive pad and a second conductive pad, a light-emitting diode, a metal protrusion, a polymer layer, and a top electrode. The substrate has a top surface. The first conductive pad and the second conductive pad are on the substrate. The light-emitting diode is on the first conductive pad. The metal protrusion is on the second conductive pad. The polymer layer covers the top surface of the substrate, the first conductive pad, the second conductive pad, the metal protrusion, and the light-emitting diode, in which a distance from a top of the metal protrusion to the top surface of the substrate is greater than a thickness of the polymer layer. The top electrode covers the light-emitting diode, the polymer layer, and the metal protrusion such that the light-emitting diode is electrically connected with the second conductive pad.