LED Insulation via Protective Layer and Convex Electrode
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Solution Overview
Problem
Existing light emitting diodes (LEDs) lack improved insulation properties and efficient manufacturing processes, particularly in the formation of molding members for light emitting devices, which can lead to electrical shorts and reduced performance.
Innovation Solution
A light emitting diode structure with a conductive support substrate, a reflective electrode layer, a protective layer, and a semiconductor layer configuration that includes a convex center portion and a peripheral protective layer to enhance insulation, along with a method of manufacturing that involves forming molding members on a circuit board and using a pressing member to deform and cure the molding members for improved insulation and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional LED structure without enhanced insulation is used, then the device complexity is reduced, but electrical shorts occur and reliability deteriorates
Solution Approach 1:
The patent applies local quality by creating a convex center portion in the reflective electrode layer and providing a protective layer specifically at the peripheral portion where electrical insulation is most critical. This localized enhancement of insulation properties at the periphery prevents electrical shorts without requiring complete structural redesign of the entire LED device.
Solution Approach 2:
The patent segments the reflective electrode layer into a convex center portion and separates it from the peripheral portion using a protective layer. This segmentation creates distinct functional zones: the center for light reflection and the periphery for electrical insulation, thereby preventing electrical shorts while maintaining optical performance.
2Productivity
If molding members are formed without simultaneous processing, then the manufacturing process is simpler, but productivity is reduced
Solution Approach 1:
The patent merges the formation of multiple molding members into a single simultaneous manufacturing process. By forming first and second molding members that surround and cover the LED respectively, in one manufacturing step, the patent achieves high productivity without requiring separate processing steps for each molding member.
Solution Approach 2:
The patent employs preliminary action by forming the first molding member that surrounds the LED before forming the second molding member that covers it. This sequential arrangement within simultaneous processing allows each molding member to be properly positioned and shaped without interfering with the other, facilitating efficient manufacturing.
3Reliability
If molding members are formed without deformation and curing processes, then the manufacturing process is faster, but the insulation properties are insufficient
Solution Approach 1:
The patent utilizes phase transitions by implementing a curing process that transforms the molding members from a moldable state to a solidified state with enhanced insulation properties. The deformation process shapes the molding members while the curing process completes the phase transition, creating durable electrical insulation without excessive time loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved insulation properties and efficient manufacturing of light emitting diodes with enhanced electrical isolation, preventing shorts and improving the overall performance and productivity of light emitting devices.
Implementation Method 1
a first molding member including a yellow phosphor can be formed to surround the light emitting diode that emits light having a wavelength of blue color. The yellow phosphor is excited by light emitted from the light emitting diode, thereby emitting excite light having a wavelength of yellow color.
Data Source
AI summary
Disclosed are a light emitting device, a conductive substrate; a second electrode layer on the conductive substrate and including a center portion and a peripheral portion surrounding the center portion; a protective layer on the peripheral portion of the second electrode layer; and a light emitting structure including a second conductive semiconductor layer on the second electrode layer, an active layer on the second conductive semiconductor layer and a first conductive semiconductor layer on the active layer; and a first electrode layer on the first conductive semiconductor layer, wherein the second conductive semiconductor layer includes edge portions extending outside of the light emitting structure.