Light Emitting Element Protective Layer for Narrow Street Dicing
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Solution Overview
Problem
Conventional methods for manufacturing light emitting elements, particularly for flip-chip mounting, face challenges such as increased thickness due to insulating members, making it difficult to achieve high productivity and precise dicing, leading to limited output and potential detachment of inorganic components during the dicing process.
Innovation Solution
A method involving the formation of semiconductor structures with specific electrode configurations and the use of an insulating member to create a flat mounting surface, allowing for narrower streets during wafer singulation, enabling more efficient flip-chip mounting and higher productivity by reducing the width of the streets between light emitting elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If an insulating member is added to create a flat mounting surface for flip-chip mounting, then the mounting surface flatness is improved, but the wafer thickness increases making dicing difficult
Solution Approach 1:
The insulating member is segmented into two distinct parts: a first insulating layer formed directly on the semiconductor structure, and a second insulating layer formed on the first insulating layer. This segmentation allows the first layer to provide the essential flat mounting surface while the second layer can be optimized for other functions, potentially reducing overall thickness or improving dicing characteristics.
Solution Approach 2:
The patent introduces a vertical layering dimension by stacking multiple insulating layers with different heights. The first insulating layer has a first height and the second insulating layer has a second height, creating a stepped structure that provides flat mounting surfaces at different elevations for different regions of the semiconductor device.
2Manufacturing precision
If the wafer thickness is increased by adding an insulating member, then a flat mounting surface is achieved, but the number of light emitting elements per wafer decreases
Solution Approach 1:
The insulating member is configured with spatially varying properties: the first insulating layer is positioned in streets (regions between light emitting elements) while the second insulating layer is positioned over the light emitting elements. This local differentiation allows the mounting surfaces to be flat where needed without uniformly increasing the thickness across the entire wafer, thereby maximizing the number of elements per wafer.
3Reliability
If conventional dicing methods are used on wafers with insulating members, then component detachment may occur, but laser dicing cannot be applied to wafers with insulating materials
Solution Approach 1:
The patent performs preliminary actions by forming the multi-layer insulating structure with specific material compositions and configurations before the dicing process. The first insulating layer is designed with adhesive properties to prevent component detachment during dicing, while the overall structure is optimized to be compatible with laser dicing methods, enabling both reliability and manufacturing ease.
Data Source
AI summary
A light emitting element for flip-chip mounting having a flat mounting surface which allows a decrease in the width of the streets of a wafer. In the light emitting element, the insulating member filling around the bumps and flattening the upper surface is formed with a margin of a region with a width which is equal to or larger than the width of the streets on the dividing lines, so that at the time of dividing the wafer along the dividing lines, the insulating member is not processed, which allows designing of the streets with a small width.