LED Package Protective Member for Chip Isolation Reliability
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Solution Overview
Problem
The LED manufacturing process requires high precision to ensure reliability and high product yield, but existing methods face challenges in preventing electric shorts and burrs during chip isolation, which affect the reliability and efficiency of light emitting devices.
Innovation Solution
A light emitting device package is developed with a conductive support member, a protective member with a thickness of 2 μm to 100 μm, and a reflective layer, along with a method of manufacturing that includes forming a protective member, a reflective layer, and a conductive support member, and dividing chips through an isolation process to prevent electric shorts and improve light efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thin protective member is used, then the device complexity is reduced, but electric shorts and burrs occur during chip isolation affecting reliability
Solution Approach 1:
The protective member is formed on the peripheral surface of the top surface of the conductive support member before the chip isolation process. This preliminary protective action prevents electric shorts and burrs from occurring during the subsequent isolation process, thereby improving reliability without requiring complex additional components.
Solution Approach 2:
The protective member acts as an intermediary layer between the conductive support member and the isolation process. It mediates the interaction by providing electrical insulation and physical protection during chip division, preventing harmful effects while maintaining process simplicity.
2Reliability
If the protective member thickness is increased, then electric shorts are prevented improving reliability, but manufacturing precision requirements increase
Solution Approach 1:
The thickness of the protective member is optimized to a specific range (2 μm to 100 μm) to achieve the necessary balance. This parameter change ensures sufficient thickness to prevent electric shorts and burrs during isolation while maintaining manufacturability and avoiding excessive precision requirements.
3Productivity
If chip isolation is performed without protective measures, then the manufacturing process is simplified, but electric shorts and burrs affect product yield
Solution Approach 1:
The protective member is formed on the conductive support member before the chip isolation process to prevent electric shorts and burrs. This preliminary protective measure improves product yield without significantly complicating the manufacturing process, as it integrates seamlessly into the existing fabrication steps.
Data Source
AI summary
A light emitting device according to the embodiment includes a conductive support member having a step portion at an outer peripheral region thereof, a protective member for filling the step portion formed at the outer peripheral region of the conductive support member, a reflective layer over the conductive support member, and a light emitting structure over the reflective layer and the protective member.