LED Display Module Assembly With Quantum Layers and Offset Tolerance
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Solution Overview
Problem
The preparation of quantum dot LED display modules is challenging due to the high precision required for the butt joint between the quantum dot substrate and the display substrate, making it difficult to assemble when the LED chip position is offset.
Innovation Solution
A processing method involving acquiring blue-emitting LED chips with different wavelengths, packaging them with reflective and isolation layers, and arranging them on temporary substrates to form packages that are then fixed to a substrate with quantum layers, eliminating the need for a butt joint and allowing for easier assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If quantum dots are filled into grooves on a substrate to form a quantum dot substrate, then the quantum dot LED display module can be prepared, but the requirement of precision for butt joint between the quantum dot substrate and the display substrate becomes very high, making it difficult to assemble when LED chip position is offset
Solution Approach 1:
The patent introduces a reflective adhesive layer as an intermediary between the LED chip and the quantum dot layer. This adhesive layer serves multiple functions: it bonds the LED chip to the substrate, reflects light to improve efficiency, and provides a tolerance buffer that eliminates the need for high-precision butt joining. The reflective adhesive mediates the connection while accommodating position offsets of LED chips, thus resolving the contradiction between module preparation and manufacturing precision requirements.
2Ease of manufacture
If the LED chip position is offset, then the quantum dot substrate and display substrate are difficult to butt, but using traditional packaging methods reduces light utilization and increases heat influence on quantum layers
Solution Approach 1:
The patent merges the packaging function with the light management function by using reflective adhesive that simultaneously packages the LED chip and reflects light back toward the quantum dot layer. This combined approach eliminates the need for separate packaging structures that would complicate assembly, while the reflective property ensures high light utilization efficiency. The merged structure accommodates LED chip position offsets without compromising optical performance.
3Ease of manufacture
If the LED chip position is offset, then the quantum dot substrate and display substrate are difficult to butt, but using traditional packaging methods increases heat influence on quantum layers
Solution Approach 1:
The reflective adhesive acts as a thermal intermediary that manages heat flow from the LED chip. By positioning the quantum dot layer on top of the reflective adhesive rather than in direct contact with the LED chip, the adhesive layer serves as a thermal buffer that reduces heat transfer to the temperature-sensitive quantum layers. This intermediary structure enables easier assembly with offset LED chips while protecting the quantum layers from excessive heat.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the assembly of LED display modules by eliminating the need for precise butt joining and addressing LED chip position offsets, improving light utilization and reducing heat influence on quantum layers, thus facilitating easier processing of quantum dot LED display modules.
Implementation Method 1
packaging a bottom and a side of the first LED chip with a first reflective adhesive, and packaging a bottom and a side of the second LED chip with a second reflective adhesive
Implementation Method 2
spraying a red quantum layer on a front surface of one of the two first packages to obtain a red quantum package; spraying a green quantum layer on a front surface of the other one of the two first packages to obtain a green quantum package
Data Source
Figure 1
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AI summary
Provided is a processing method of an LED display module. The processing method of the LED display module includes following steps: acquiring a first LED chip (11) emitting blue light and a second LED chip (12) emitting blue light, a wavelength of the first LED chip (11) being smaller than a wavelength of the second LED chip (12); placing the first LED chip (11) on a first temporary substrate (21) with a front surface of the first LED chip (11) facing upward, and placing the second LED chip (12) on a second temporary substrate(22) with a front surface of second LED chip (12) facing upward; fixing a plurality of display units to a substrate (23), each of the plurality of display units including two first packages (1) and one second package (2); spraying a red quantum layer (51) on a front surface of one of the two first packages (1) to obtain a red quantum package; spraying a green quantum layer (52) on a front surface of the other one of the two first packages (1) to obtain a green quantum package; and a front surface of the red quantum package, a front surface of the green quantum package and a front face of the second package (2) being flush. A technical solution of the application effectively solves a problem that a quantum dot LED display module is difficult to prepare in the related art.