Raised Attachment Members for LED Thermal Isolation

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Solution Overview

Problem

Conventional light emitting devices face challenges in attaching electrical components due to the difficulty of soldering, which is time-consuming and energy-intensive, especially when the LED component is already attached to a heatsink, leading to inefficient installation and manufacturing processes in industrial and commercial lighting applications.

Innovation Solution

The development of novel attachment devices and methods for light emitting devices that include raised attachment members and solder-free, gas-tight electrical connectors, which reduce thermal coupling and eliminate the need for soldering, allowing for easier and faster electrical connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If soldering techniques are used to join components to attachment surfaces, then electrical connection is achieved, but the process becomes time-consuming and energy-intensive

Engineering Contradiction:

Improveelectrical connectionVSAvoidinstallation time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The attachment surface is segmented into a raised portion and a flat portion, allowing different connection methods for different components. The raised portion provides mechanical support and thermal management, while the flat portion enables simplified electrical connection without requiring full soldering of the entire assembly.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The attachment surface transitions from a two-dimensional flat surface to a three-dimensional structure with a raised portion. This vertical dimension allows the electrical component to be mounted on the raised portion, reducing thermal coupling with the heatsink while maintaining electrical connection reliability.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If the entire heatsink assembly is heated for soldering, then good solder flow is achieved, but portions unsuited for heat are damaged and energy consumption increases

Engineering Contradiction:

Improvesolder flowVSAvoidheat damage

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The attachment surface is divided into a raised portion and a flat portion, allowing localized soldering on the flat portion without heating the entire heatsink assembly. This segmentation enables precise thermal control, applying heat only where needed for solder flow while protecting other components from thermal damage.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The flat portion of the attachment surface is specifically designed to provide a localized area for soldering operations. This local quality ensures that heat is concentrated only on the solder joint area, achieving good solder flow while minimizing thermal exposure to the rest of the heatsink assembly.

Inventive Principle:

Principle #3Local quality

3Ease of manufacture

If attachment surfaces are made flat for easy component placement, then manufacturing is simplified, but thermal coupling increases making soldering difficult

Engineering Contradiction:

Improvecomponent placementVSAvoidthermal coupling

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The attachment surface is segmented into a raised portion and a flat portion, each serving distinct functions. The flat portion simplifies component placement and provides a stable base, while the raised portion reduces thermal coupling to enable effective soldering by creating thermal isolation from the heatsink.

Inventive Principle:

Principle #1Segmentation

4Ease of manufacture

If raised attachment members are used to reduce thermal coupling, then soldering becomes easier, but device complexity increases

Engineering Contradiction:

Improvesoldering processVSAvoidattachment structure

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The attachment surface is segmented into a raised portion and a flat portion, providing thermal isolation to facilitate soldering while maintaining manufacturing simplicity. The segmentation is achieved through a single continuous structure that integrates both functions, avoiding excessive complexity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The raised attachment member serves multiple functions: it provides mechanical support for the electrical component, reduces thermal coupling to enable effective soldering, and maintains a compact design. This multi-functionality reduces the need for additional components, thereby limiting the increase in device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS9300062B2Attachment devices and methods for light emitting devices

Publication Date: 2016.03.29 CREELED INC

AI summary

Attachment devices and methods for use with light emitting devices are provided. In one aspect, the light emitting device can include a submount and a light emission area disposed over the submount. The device can further include at least one attachment member provided on the submount. The attachment member can engage an electrical component thereby providing a gas-tight, solder free connection between the attachment member and electrical component.