LED Package Recess Anchoring for Encapsulant Delamination Resistance
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Solution Overview
Problem
Conventional LED packages face challenges with encapsulant adhesion due to thermal and physical stresses, leading to delamination and moisture ingress, which compromises the reliability and longevity of the devices, especially in outdoor environments.
Innovation Solution
Incorporation of anchoring structures along the recess sidewalls of LED packages to increase the surface area for improved adhesion of encapsulant materials, which conform to these structures, thereby enhancing contact area and reducing delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional smooth recess sidewalls are used in LED packages, then manufacturing is simpler, but encapsulant adhesion deteriorates under thermal and physical stresses
Solution Approach 1:
The recess sidewalls are given different local qualities through anchoring structures. While most of the sidewall remains smooth for easy manufacturing, specific localized regions contain anchoring structures (protrusions, indentations, or textured surfaces) that provide enhanced adhesion points for the encapsulant material, resolving the contradiction between manufacturing simplicity and adhesion reliability
Solution Approach 2:
The anchoring structures introduce curved and non-planar surfaces (such as rounded protrusions, curved indentations, or textured surfaces) on the recess sidewalls. These curved surfaces increase the surface area and provide better mechanical interlocking with the encapsulant material compared to flat surfaces, thereby improving adhesion without requiring complete structural complexity
2Reliability
If encapsulant adhesion is improved through surface treatment, then delamination resistance increases, but manufacturing complexity increases
Solution Approach 1:
The anchoring structures are merged with the recess sidewall structure itself rather than being separate components. The anchoring features are integrated directly into the mold cavity or substrate during the same manufacturing process, combining the structural support function with the adhesion enhancement function in a single integrated element
Solution Approach 2:
The anchoring structures are pre-formed in the recess sidewalls before encapsulant application. By preparing the anchoring features in advance during recess fabrication, the need for subsequent complex surface treatment steps is eliminated, maintaining manufacturing simplicity while ensuring adhesion readiness
3Reliability
If anchoring structures are added to recess sidewalls, then encapsulant adhesion improves, but device complexity increases
Solution Approach 1:
The anchoring structures are designed as thin, integrated features that extend only partially into the recess, rather than bulky three-dimensional structures. This thin-film approach provides sufficient adhesion improvement while minimizing the added complexity and volume of the overall device structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The anchoring structures improve encapsulant adhesion, reducing delamination rates and moisture ingress, leading to increased reliability and extended operational life of LED packages, particularly in outdoor conditions.
Implementation Method 1
anchoring structures that improve adhesion with encapsulant materials
Data Source
AI summary
Light-emitting diode (LED) devices and more particularly anchored encapsulation in LED packages and related structures is disclosed. Anchoring structures are described herein that improve adhesion with encapsulant materials. Exemplary LED packages include support structures with recesses and one or more anchoring structures integrated along recess sidewalls, thereby increasing surface areas of the recess sidewalls. When encapsulant materials are provided within the recesses, portions of encapsulant materials may conform to the anchoring structures to promote increased contact area between the encapsulant materials and the support structures. Exemplary support structures include lead frame structures with housings that form the recesses or submount structures.