LED Recess Structure for Light Extraction and Thermal Management
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Solution Overview
Problem
Current light emitter device components, such as LED packages, fail to maximize light extraction efficiency due to suboptimal recess designs in their housings, which limits the brightness and thermal management capabilities in space-limited applications.
Innovation Solution
The design of light emitter device components with improved recess structures that minimize the surface area outside the recess to less than 25% of the overall surface area, maximizing the opening of the recess to enhance light extraction and thermal efficiency, using materials like low temperature co-fired ceramic (LTCC) and incorporating reflective and thermal management features.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If traditional LED package designs are used, then the package structure is simple and easy to manufacture, but the light extraction efficiency is limited and brightness is insufficient
Solution Approach 1:
The package cavity is divided into multiple reflective surfaces including side walls and a bottom surface, each designed to reflect light in specific directions. This segmentation of reflective functions across multiple surfaces maximizes light extraction efficiency while maintaining a relatively simple overall package structure that can be manufactured using conventional techniques.
2Illumination intensity
If the recess opening is minimized to reduce surface area outside the recess, then light extraction is enhanced, but the overall package size is reduced which may limit thermal management capabilities
Solution Approach 1:
The package design implements local quality optimization by creating a recess with highly reflective surfaces concentrated at the light extraction region, while the outer package structure maintains sufficient surface area for thermal management. The reflective properties are localized to where they are most beneficial for light extraction, while thermal management areas are preserved in the overall package structure.
3Illumination intensity
If reflective materials are added to the package housing, then light extraction is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The reflective surfaces are integrated directly into the package housing structure itself, merging the reflective function with the structural housing. This eliminates the need for separate reflective material layers or additional manufacturing steps to apply reflective coatings, thereby maintaining ease of manufacture while achieving improved light extraction efficiency through the geometric design of the recess.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases the amount of light extracted per LED component, improves thermal management, and reduces the overall size of the package, effectively addressing the limitations of prior art in brightness and efficiency.
Implementation Method 1
the selection of reflective materials surrounding the LED chips within the housing
Implementation Method 2
incorporation of design features which improve, for example, thermal properties
Data Source
AI summary
Components and methods containing one or more light emitter devices, such as light emitting diodes (LEDs) or LED chips, are disclosed. In one aspect, a light emitter device component can include inner walls forming a recess defining an opening such that surface area outside of the opening of the recess is less than or equal to a threshold ratio of overall surface area. In one aspect, the light emitter device component can include a ceramic body mounted directly or indirectly on the ceramic body. Components disclosed herein can result in improved light extraction and thermal management.