LED Light Emitting Device With Reflective Encapsulant
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Solution Overview
Problem
Existing light emitting devices, particularly those using LEDs, face challenges in achieving uniform light distribution and effective heat dissipation, which affects their performance and reliability, while also requiring cost-effective manufacturing.
Innovation Solution
The design incorporates a leadframe with a light emitting unit, a transparent encapsulant with reflective surfaces, and a fluorescent colloid layer to guide light and enhance heat dissipation, using a non-transparent side element or carrier to control light output and manage heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If LED is used as a point light source, then the device can be made small and compact, but the light distribution becomes non-uniform
Solution Approach 1:
The patent segments the light emitting function by using multiple LED chips arranged in a matrix pattern rather than a single point source. This segmentation distributes the light emission across multiple points, creating more uniform illumination while maintaining a compact overall device structure.
Solution Approach 2:
The patent transitions from a single-point (0D) or linear (1D) light source to a two-dimensional matrix arrangement of LED chips. This dimensional change allows light to be emitted from multiple spatial locations simultaneously, achieving uniform illumination across the emission surface while keeping the device compact.
2Device complexity
If conventional light emitting devices are used, then the structure is simple, but heat dissipation is insufficient
Solution Approach 1:
The patent merges the light emission function with the heat dissipation function by integrating LED chips directly onto a heat sink structure. The heat sink serves dual purposes: it dissipates heat from the LED chips and provides structural support for the LED matrix arrangement, thereby improving heat dissipation without significantly increasing structural complexity.
3Ease of manufacture
If manufacturing cost is reduced, then device reliability may be compromised
Solution Approach 1:
The patent designs the heat sink to serve multiple functions: heat dissipation, structural support for LED mounting, and light reflection toward the emission surface. This multi-functionality reduces the need for separate components, lowering manufacturing cost while maintaining or improving device reliability through integrated design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves a uniform light emitting effect, improves heat dissipation, and reduces manufacturing costs while maintaining device reliability, making it suitable for various applications.
Implementation Method 1
The light generated by the light emitting unit is reflected by the reflective surface and guided to a side wall of the fluorescent colloid layer
Implementation Method 2
The fluorescent colloid layer is disposed outside the transparent encapsulant, wherein a chamber is formed between the fluorescent colloid layer and the transparent encapsulant. The light generated by the light emitting unit is reflected by the reflective surface and guided to a side wall of the fluorescent colloid layer
Data Source
AI summary
A light emitting device includes a leadframe, a light emitting unit, a transparent encapsulant, and a fluorescent colloid layer. The light emitting unit is disposed on the leadframe. The transparent encapsulant covers the light emitting unit, wherein the transparent encapsulant has a concave on which at least one reflective surface is disposed. The fluorescent colloid layer is disposed outside the transparent encapsulant, wherein a chamber is formed between the fluorescent colloid layer and the transparent encapsulant. The light generated by the light emitting unit is reflected by the reflective surface and guided to a side wall of the fluorescent colloid layer.