Semiconductor Light Emitting Device Recess Reflector Heat Dissipation
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Solution Overview
Problem
Conventional semiconductor light emitting devices suffer from inefficient light emission due to unused reflector portions and heat dissipation issues, leading to reduced luminance and increased heat generation with higher input power.
Innovation Solution
A semiconductor light emitting device with a reflector surrounding the light emitting element and a highly heat conductive material between the element and the recess, allowing full light reflection and efficient heat dissipation, enhancing light emission efficiency and output.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the LED chip is covered with light transmitting resin to protect and transmit light, then light transmission is improved, but heat dissipation deteriorates
Solution Approach 1:
The patent divides the encapsulation structure into two distinct functional zones: an upper light transmitting resin portion for light transmission and protection, and a lower heat dissipation resin portion containing heat dissipation agents for thermal management. This segmentation allows each material to optimize its primary function without compromising the other.
Solution Approach 2:
The patent applies local quality by creating a heat dissipation resin layer with specific thermal conductivity properties at the critical heat generation zone (bottom of LED chip), while maintaining optically clear resin at the light emission zone. The heat dissipation agents are localized where heat generation is most intense.
2Illumination intensity
If input power is increased to increase luminance, then light output is improved, but heat generation worsens
Solution Approach 1:
The patent converts the harmful heat generated by high-power LED operation into a manageable thermal flow by incorporating heat dissipation agents in the lower resin portion. The heat that would otherwise degrade performance is channeled through the heat dissipation layer to the substrate, enabling sustained high luminance output.
3Ease of manufacture
If a simple recess structure is used for mounting LED chip, then manufacturing simplicity is improved, but light reflection efficiency deteriorates
Solution Approach 1:
The patent makes the lower resin portion serve multiple functions: it acts as a heat dissipation medium, provides mechanical support for the LED chip, and functions as a reflective surface to redirect light. This multi-functionality eliminates the need for separate reflector components while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution increases luminance and brightness by utilizing the entire reflector for light reflection and effectively dissipating heat, thereby improving light emission efficiency and output.
Implementation Method 1
A highly heat conductive material having a thermal conductivity higher than that of the light transmitting resin is loaded between the semiconductor light emitting element and the recess
Implementation Method 2
The side surface 91a serves as a reflector for reflecting the light emitted from the LED chip 92
Data Source
AI summary
A semiconductor light emitting device (A) includes a semiconductor light emitting element (2) including a light emitting layer (22), a lead (1) formed with a reflector (11) that surrounds the semiconductor light emitting element (2), a light transmitting resin (4) covering the semiconductor light emitting element (2). The reflector (11) of the lead (1) includes a recess (12) at the bottom surface. The semiconductor light emitting element (2) is mounted to a bottom surface of the recess (12), with the light emitting layer (22) positioned outside the recess (12). A highly heat conductive material (3) having a thermal conductivity higher than that of the light transmitting resin (4) is loaded between the semiconductor light emitting element (2) and the recess (12).