Light Emitting Element Reinforcing Portion for Pressure Damage
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Solution Overview
Problem
Traditional light emitting elements face damage to the semiconductor layer due to pressure exerted by resin layers or similar post-processing methods, which can compromise the integrity and efficiency of the device.
Innovation Solution
A light emitting element design featuring a semiconductor layer with a pair of electrodes on its lower face and a reinforcing portion made from a light-transmissive material on its upper edge, which increases the strength at the ends of the semiconductor layer and minimizes light emission reduction, while an underfill material supports the semiconductor layer and enhances reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a resin layer or similar post-processing method is applied to the light emitting element, then the device structure is completed and sealed, but pressure is exerted on the semiconductor layer causing damage to the end of the semiconductor layer
Solution Approach 1:
A reinforcing portion made of light-transmissive material is formed on the upper face of the semiconductor layer before post-processing steps. This reinforcing portion acts as a protective cushion that distributes and absorbs pressure during subsequent resin layer application and packaging processes, preventing damage to the semiconductor layer while maintaining device integrity
Solution Approach 2:
The light emitting element employs a composite structure combining the semiconductor layer with a reinforcing portion made of light-transmissive material. This composite design integrates materials with different mechanical properties - the semiconductor layer for light emission and the reinforcing portion for mechanical strength - allowing the device to withstand post-processing pressures while maintaining optical performance
2Strength
If a reinforcing portion is added to protect the semiconductor layer, then the strength at the ends of the semiconductor layer is increased, but the device structure becomes more complex
Solution Approach 1:
The reinforcing portion serves multiple functions simultaneously: it strengthens the semiconductor layer against pressure, acts as a template for forming the light-transmissive material layer, and maintains structural integrity during post-processing. This multi-functionality reduces the need for additional separate protective components, thereby limiting the increase in device complexity
Solution Approach 2:
The reinforcing portion is integrated into the existing semiconductor layer structure rather than being added as a separate external component. The light-transmissive material that forms the reinforcing portion is deposited directly on the semiconductor layer, merging the protective function with the existing device architecture and minimizing structural complexity
3Reliability
If the semiconductor layer is protected during post-processing, then damage is suppressed, but light emission efficiency may be reduced
Solution Approach 1:
The reinforcing portion is strategically positioned on the upper face of the semiconductor layer, specifically at regions where pressure is most likely to be applied during post-processing. This localized reinforcement protects vulnerable areas while leaving other regions unchanged, thereby minimizing the impact on light emission efficiency
Solution Approach 2:
The light-transmissive material used for the reinforcing portion is selected and configured to have optical properties that match or are compatible with the semiconductor layer. By controlling the material's transparency, thickness, and refractive index, the reinforcing portion maintains light transmission characteristics that preserve light emission efficiency while providing mechanical protection
Data Source
AI summary
A light emitting element has a semiconductor layer, a pair of positive and negative electrodes, and a reinforcing portion. The pair of positive and negative electrodes is disposed on a lower face side of the semiconductor layer. The pair of electrodes is connected to the substrate. The reinforcing portion is disposed on an outer edge part of an upper face of the semiconductor layer. The reinforcing portion is made from a light-transmissive material. The upper face includes an exposed portion exposed from the reinforcing portion.