Light Emitting Device Resin Frame Refractive Index Design
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Solution Overview
Problem
Current light emitting devices face challenges in achieving high light emission efficiency due to limitations in heat dissipation and structural design, which affect their performance and durability.
Innovation Solution
A light emitting device is designed with a base member having a first lead, a second lead, and a supporting member, where the light emitting element and a protective element are mounted, and a resin frame with specific refractive index layers are used to enhance light extraction efficiency by reducing reflection at interfaces and improving heat dissipation through metal leads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a resin frame is provided on the pedestal part to stop the flow of encapsulating resin, then heat dissipation property and durability are improved, but light emission efficiency is reduced due to light reflection at resin interfaces
Solution Approach 1:
The patent applies local quality by providing a light-reflective member with high refractive index (such as titanium oxide or silicon oxide) specifically at the light extraction surface of the light emitting element, while other resin portions use lower refractive index materials. This localized differentiation optimizes light extraction efficiency at critical interfaces without compromising the overall encapsulation structure's heat dissipation and protective functions.
Solution Approach 2:
The patent changes the refractive index parameter of resin materials at different locations within the encapsulation structure. By using resin with higher refractive index at the light extraction surface and lower refractive index in other encapsulation regions, the patent optimizes light emission efficiency while maintaining structural integrity and heat dissipation properties.
2Illumination intensity
If resin materials with different refractive indices are used in different regions, then light extraction efficiency is improved, but device complexity increases
Solution Approach 1:
The patent segments the encapsulation resin into multiple regions with different refractive indices: a first resin portion surrounding the light emitting element with higher refractive index for optimal light extraction, and a second resin portion for other encapsulation functions with lower refractive index. This segmentation allows optimized optical performance at critical interfaces while maintaining simplified structure in non-critical regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves light emission efficiency by minimizing light reflection and enhancing heat dissipation, leading to a more reliable and efficient light emitting device with improved durability and reduced size.
Implementation Method 1
The resin frame includes a resin portion and a light-reflective member. The first resin part has a refractive index greater than a refractive index of the second resin part, and greater than a refractive index of the resin portion of the resin frame. The light-reflective member of the resin frame has a refractive index greater than a refractive index of the resin portion of the resin frame.
Data Source
AI summary
A light emitting device includes: a base member including: a first lead, a second lead, and a supporting member holding the first lead and the second lead while electrically separating the first lead and the second lead from each other; a light emitting element located on the first lead; a resin frame located on the upper surface of the base member; a first resin part surrounded by the resin frame and covering the light emitting element; and a second resin part covering the resin frame and the first resin part. The first lead includes a main part having a plurality of projecting parts disposed at a lateral surface between an upper surface and a lower surface of the main part. The plurality of projecting parts overlap with the resin frame in a plan view.