Semiconductor LED Row Layout for Uniform Current Distribution
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Solution Overview
Problem
Existing semiconductor light-emitting devices face issues with increased size due to electrode pad placement and unbalanced current distribution among light-emitting elements connected in series.
Innovation Solution
A semiconductor light-emitting device with a translucent substrate, light-emitting elements, insulating layers, and electrode pads, where the light-emitting elements are disposed in a row with balanced electrode lengths to ensure uniform current distribution, and the electrode pads are strategically placed to cover and connect the elements while reflecting emitted light for improved output.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrode pads are disposed in regions separate from light-emitting elements, then electrical connection is achieved, but device size increases
Solution Approach 1:
The patent merges the electrode pad region with the light-emitting element region by disposing electrode pads adjacent to light-emitting elements on the same substrate, rather than in separate regions. This integration reduces the overall device area while maintaining reliable electrical connection functionality.
2Reliability
If light-emitting elements are connected in series via wires, then electrical connection is achieved, but current distribution becomes unbalanced
Solution Approach 1:
The patent extracts the wire connection method and replaces it with direct substrate-based electrical connection. By removing the intermediate wire connections, the design achieves more uniform current distribution across light-emitting elements while maintaining series connection functionality through the substrate conductive layers.
3Area of stationary object
If electrode pads are disposed adjacent to light-emitting elements, then device size is reduced, but manufacturing complexity increases
Solution Approach 1:
The substrate serves multiple functions simultaneously: it acts as the mechanical support structure, provides the conductive path for electrical connection, and defines the spatial arrangement for both light-emitting elements and electrode pads. This multi-functionality simplifies manufacturing by reducing the number of separate components and assembly steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for a compact design with uniform current distribution among light-emitting elements, enhancing light output and preventing local deterioration, enabling efficient operation with a high voltage drive system.
Implementation Method 1
The insulating layer covers the plurality of light-emitting elements on the substrate
Implementation Method 2
Each of the plurality of light-emitting elements includes a first semiconductor layer, a light-emitting layer, a second semiconductor layer
Data Source
AI summary
A semiconductor light-emitting device includes a translucent substrate, a row of light-emitting elements on the substrate, an insulating layer, and first and second electrode pads. Each light-emitting element includes a first semiconductor layer of a first conductivity type formed on the substrate, a light-emitting layer formed on the first semiconductor layer, a second semiconductor layer of opposite conductivity type formed on the light-emitting layer, a first electrode on the first semiconductor layer, and a second electrode on the second semiconductor layer. The insulating layer covers the light-emitting elements so as to form a first opening and a second opening. The first opening exposes the first electrode of the light-emitting element in one end side of the row of light-emitting elements. The second opening exposes the second electrode of the light-emitting element in another end side of the row of light-emitting elements. The first electrode pad covers the first opening and is formed from the first opening over one region on the insulating layer, and is electrically connected to the first electrode. The second electrode pad covers the second opening and is formed from the second opening over another region spaced from the one region on the insulating layer, and is electrically connected to the second electrode.