LED Package Light Scattering Particles Heat Dissipation
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Solution Overview
Problem
Light output devices with embedded LED packages in thermoplastic materials face issues with heat conductivity and bright spots due to the insulating properties of the thermoplastic, limiting maximum power and light output, and causing potential safety hazards from 'hot spots'.
Innovation Solution
Incorporating light scattering particles with high thermal conductivity (at least 1 W/mK) into the translucent thermoplastic layer to scatter light and dissipate heat effectively, reducing bright spots and improving heat distribution, while non-light scattering particles can be added to enhance thermal conductivity independently of light scattering effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermoplastic material is used to embed LED packages, then wear resistance and electrical safety are improved, but heat conductivity deteriorates causing heat accumulation and limited maximum power
Solution Approach 1:
The patent uses a composite material system consisting of thermoplastic material combined with high thermal conductivity particles (such as metal particles, ceramic particles, or graphite particles). This composite structure maintains the protective properties of the thermoplastic material while adding heat dissipation capabilities through the conductive particles, thereby resolving the contradiction between wear resistance and heat conductivity.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the thermoplastic material by incorporating particles with high thermal conductivity. This parameter modification allows the material to maintain its protective functions while significantly improving heat dissipation performance, enabling higher LED power outputs without excessive heat accumulation.
2Ease of manufacture
If LED packages are embedded in thermoplastic material, then manufacturability is improved, but bright spots are caused due to point source light emission and total internal reflection
Solution Approach 1:
The patent introduces light scattering particles as an intermediary element within the thermoplastic material. These particles act as mediators that intercept and scatter the point source light from LED packages, converting concentrated light into diffused illumination. This resolves the bright spot issue while maintaining the manufacturing advantages of embedded LED packages.
Solution Approach 2:
The patent modifies the local optical properties of the thermoplastic material by distributing light scattering particles throughout the material matrix. This creates localized light scattering centers that collectively transform the overall light distribution pattern, converting point source emission into area source illumination without changing the LED package structure.
3Reliability
If thermoplastic material is used for embedding LED packages, then device protection is improved, but heat insulation causes hot spots that may hurt persons handling the device
Solution Approach 1:
The patent creates a composite material system where thermoplastic material provides protective enclosure while embedded high thermal conductivity particles create heat dissipation pathways. This composite structure allows the material to simultaneously provide mechanical protection and thermal management, preventing hot spot formation while maintaining device protection.
Solution Approach 2:
The patent converts the heat insulation property of thermoplastic material, which initially causes harmful hot spots, into a beneficial heat dissipation system by incorporating conductive particles. The same material matrix that previously trapped heat now serves as a medium for efficient heat transport when combined with high thermal conductivity particles, turning the harmful insulation effect into a beneficial cooling mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces bright spots and heat-related issues by scattering light and enhancing heat dissipation, allowing for increased power and light output while maintaining uniformity and safety.
Implementation Method 1
the light from the LED package traveling through the translucent layer will be scattered by the scattering particles in random directions
Implementation Method 2
the high thermal conductivity of these particles dissipates the heat from the LED package effectively
Data Source
Figure 1~2
Figure 3~4
AI summary
The present invention relates to a light output device (100) comprising a LED package (4) at least partly embedded in a translucent layer (5) of a thermoplastic material, characterized in that the translucent layer(5) comprises light scattering particles (6) having a higher thermal conductivity than the thermal conductivity of the thermoplastic material of the translucent layer (5).