Lighting Heating/Cooling Arrangements TRIZ Cases

An air flow passage in the bending adhesive layer discharges trapped bubbles, preventing module separation and improving manufacturing yield.

Segmented airflow paths cool anode components while integrated ducts reduce apparatus size.

Windows in the heat dissipator allow leaked light to enhance brightness while a resin reflector reduces manufacturing costs compared to specialized metal parts.

Varying thickness vapor chambers and reflux passages circulate cooling liquid to improve heat dissipation performance for LED lamps.

A laser-based white light device focuses monochromatic excitation onto a conversion medium to generate broad-spectrum illumination.

A horticulture lighting fixture uses a flow disruptor to enhance turbulence in the cooling chamber for improved thermal transfer.

Rotating phosphor wheel with convex substrate back surface enhances air contact area for improved thermal exchange.

A lighting device uses a columnar support with radiation layers to dissipate heat from an LED light source.

Moveable auxiliary reflectors adjust light output aperture to redirect incident rays away from the primary target area.

Separating the light-emitting chip from the quantum dot layer prevents heat degradation, increasing luminance and color saturation while avoiding chroma offset.

Remote phosphor LED lamps use scattering diffusers to mask heat sources and achieve omnidirectional emission patterns.

An omni-directional LED lamp embeds fins within the structure using nested lenses to resolve the trade-off between thermal management and device shape.

Elongate members with pointed tips create localized turbulence to transfer heat between a fluid and an object.

A light tunnel guides divergent excitation light to widely irradiate a phosphor layer for efficient wavelength conversion.

Rear-surface illuminating parts combined with circulating air manage heat while keeping the display device compact for outdoor use.

Standardizing convex lens shapes in a UV LED array reduces mold costs while maintaining high cumulative power.

Integrated metal board fins dissipate heat into water, eliminating bulky traditional heat sinks and reducing device weight for portable underwater use.

Ultrasonic bonding joins metal-core PCBs directly to heat sinks using mechanical vibration.

Spiral sliding grooves drive axial lens movement to resolve the trade-off between adjustable center illuminance and device complexity.

An agitator inside a rotatable heat sink circulates cooling fluid to dissipate heat from optical wavelength conversion materials without mechanical seals.

Elastic sheets clamp a decorative cover to a lamp radiator, enabling easy replacement without replacing the entire unit.

A translucent thermoplastic layer embeds high thermal conductivity particles to scatter light and dissipate heat from an LED package.

A solid state lamp uses a remote phosphor layer and diffuser to convert directional LED light into an omnidirectional emission pattern.

A sealed box and conduit system circulates filtered air to maintain low operating temperatures for wavelength conversion layers.

A transparent cover with sealed dielectric fluid conveys heat from the chip to the aperture.

Stationary wavelength converting member coupled to beam shaping heat conducting element directs light within a collection angle.

Bridging elements in a vapor chamber bending section provide structural support to prevent collapse during small-radius bending.

Variable fin cross-sections in a polymer heatsink improve radiation efficiency while minimizing weight compared to heavy metal alternatives.

A hermetic light fixture seal uses differential thermal expansion to maintain enclosure integrity.

Crystallization accelerator improves molding processability and strength while maintaining high thermal conductivity.

Independent cooling adjusts light emitting unit length to resolve manufacturing tolerance issues and eliminate classification complexity.

A fire-rated lighting housing integrates a retarding material along the sidewall to maintain structural integrity during thermal exposure.

A MEMS device uses Lorentz force to vibrate a fan structure, providing active cooling for high-power light assemblies.

A light source housing directs cooling airflow through a curved path to dissipate heat from the phosphor wheel.

Angle-selective optical filter transmits light at specific incidence angles, resolving the trade-off between high illumination intensity and device complexity.

Coated fibers in a polymeric matrix increase thermal conductivity, resolving heat dissipation limits in compact LED enclosures.

A lamp uses a two-sided source plate to generate white and colored light, resolving the trade-off between color versatility and device complexity.

Elongated heat transferring elements conduct LED heat to the housing, eliminating active cooling needs in compact ceiling installations.

Varying thickness in a pear-shaped LED bulb envelope scatters light to eliminate hot spots while maintaining energy efficiency.

A separate pressing member carries positioning pins to secure the light source, simplifying the heat radiator shape and easing removal.

Spacing the cylindrical optical element 1.5 inches from the LED assembly improves light distribution efficiency while maintaining high color rendering index.

Segmented heat sink with larger upper fins boosts dissipation while fitting standard trim.

A glass lens with a perimeter rim and rubber seal couples directly between heat sink and trim body.

A stereoscopic-shaped insulated radiating rubber molded article wraps around an electrical apparatus to improve handling properties during attachment.

Direct screwing of a large threaded stud into a heatsink eliminates high thermal resistance, enabling 400W operation without forced air circulation.

Dual fans generate opposing airflows that mix before exhausting through the projector air vent, eliminating localized high temperatures at the vent.

Curved reflector geometry redirects light from concealed sources to achieve uniform wall illumination without adding hardware complexity.

Bonding a metal film to a plate-shaped wavelength conversion member dissipates heat, reducing thermal quenching and maintaining high light usage efficiency.

A gas-filled enclosure couples thermally to an LED array, preventing degradation during high-temperature bulb assembly.

Synchronizing synthetic jet activation with component heat generation improves cooling efficiency and prevents overheating.