Vapor Chamber Bending Section Bridging Elements
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Solution Overview
Problem
Vapor chambers with high thermal conductivity are not suitable for device miniaturization due to their planar configuration and tendency to collapse when bent at small radii, limiting heat exchange efficiency in compact electronic components.
Innovation Solution
A vapor chamber element with a bending section having a higher volume fraction of bridging elements, providing structural support to prevent collapse and facilitate bending at small radii, while maintaining sufficient thermal conductivity through a wick structure and bridging elements connecting parallel plates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If vapor chambers are bent at small radii to enable device miniaturization, then compactness is improved, but the vapor chambers collapse and lose structural integrity
Solution Approach 1:
The vapor chamber is divided into multiple sections along its length, with each section containing a specific arrangement of bridging elements. The bending section is segmented into multiple sub-sections with varying bridging element densities, allowing localized flexibility while maintaining overall structural integrity. This segmentation enables the vapor chamber to be bent at small radii without collapsing.
Solution Approach 2:
Different sections of the vapor chamber have different volume fractions of bridging elements tailored to their specific functional requirements. The bending section has a higher volume fraction (0.05-0.5) compared to basic sections, providing localized structural support where bending occurs. This local quality variation allows the vapor chamber to maintain structural integrity in critical areas while enabling flexibility in bending zones.
2Stability of the object's composition
If bridging elements are added to prevent collapse during bending, then structural integrity is improved, but thermal conductivity may be reduced due to increased volume occupation
Solution Approach 1:
The bridging elements are strategically distributed with varying volume fractions in different sections of the vapor chamber. The bending section has a higher volume fraction (0.05-0.5) of bridging elements to provide structural support during bending, while basic sections have lower volume fractions to maintain optimal thermal conductivity. This local quality variation resolves the contradiction by providing structural integrity only where needed.
Solution Approach 2:
The volume fraction of bridging elements is optimized within a specific range (0.05-0.5) to balance structural support and thermal conductivity. By controlling the volume fraction parameter, the invention achieves sufficient mechanical strength to prevent collapse during bending while maintaining adequate thermal performance for heat exchange operations.
3Reliability
If vapor chambers are made planar to achieve maximum heat exchange, then thermal conductivity is improved, but adaptability to compact device configurations is reduced
Solution Approach 1:
The vapor chamber is divided into basic sections and bending sections that can be arranged in different configurations. This segmentation allows the vapor chamber to maintain effective heat exchange surfaces while adapting to various device layouts, including bent and folded configurations that fit within compact electronic device form factors.
Solution Approach 2:
The vapor chamber design incorporates bending sections that allow the structure to extend into three-dimensional space through controlled bending. This enables the vapor chamber to maintain sufficient surface area for heat exchange while adapting to compact device configurations by utilizing vertical and lateral dimensions rather than only planar expansion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables vapor chambers to be bent at small radii without collapsing, enhancing heat exchange efficiency and compactness in electronic devices by maintaining structural integrity and thermal performance.
Implementation Method 1
maintaining sufficient thermal conductivity through a wick structure and bridging elements connecting parallel plates
Implementation Method 2
Vapor chambers with thermal conductivities in the range of 15000-27000 W/mK
Data Source
AI summary
The invention provides a vapor chamber element (1000), wherein the vapor chamber element (1000) comprises a first plate (110) and a second plate (120) with a chamber (100) in between, wherein the chamber (100) has a first height (H1), wherein the vapor chamber element (1000) further comprises bridging elements (150) bridging at least part of the first height (H1), wherein the vapor chamber element (1000) comprises a plurality of sections (130) configured along a first axis (A), wherein the plurality of sections (130) comprises (i) a bending section (131) having a first volume fraction V1 of bridging elements (150), and (ii) a basic section (133) having a second volume fraction V2 of bridging elements (150), wherein 2≤V1/V2.