Thermally Conductive Resin Composition Crystallization Accelerator
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Solution Overview
Problem
Existing thermally conductive resin compositions face challenges in achieving high thermal conductivity while maintaining molding processability and strength, as increasing the amount of thermally conductive fillers can lead to reduced flowability and strength, making molding difficult.
Innovation Solution
Incorporating a crystallization accelerator into the thermally conductive resin composition containing a thermoplastic resin and thermally conductive fillers to accelerate the crystallization of the thermoplastic resin, enhancing the thermal conductivity and molding processability by improving the crystallinity of the resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the blending amount of thermally conductive filler is increased to increase thermal conductivity, then thermal conductivity is improved, but flowability and strength are greatly lowered making molding difficult
Solution Approach 1:
The patent changes the physical and chemical parameters of the thermoplastic resin by controlling its crystallinity (30-80%) and molecular weight (10,000-70,000), which allows the resin composition to maintain high thermal conductivity while preserving adequate flowability and strength for molding. This parameter optimization resolves the contradiction between thermal conductivity and molding processability.
Solution Approach 2:
The patent creates a composite material system consisting of thermoplastic resin, thermally conductive filler, and crystallization accelerator working together. The specific combination and ratios of these components enable the system to achieve high thermal conductivity without sacrificing molding processability, as the composite structure allows synergistic effects among the components.
2Temperature
If the blending amount of thermally conductive filler is increased to increase thermal conductivity, then thermal conductivity is improved, but strength is greatly lowered
Solution Approach 1:
The patent optimizes the molecular weight of the thermoplastic resin (10,000-70,000) and controls the crystallinity (30-80%) to maintain adequate strength even with high filler content. By adjusting these parameters, the resin matrix retains sufficient mechanical integrity to support the thermally conductive filler network.
Solution Approach 2:
The patent creates local crystalline regions within the resin matrix that act as reinforcement points. These crystalline structures are distributed throughout the material to provide localized strength enhancement, allowing the overall material to maintain strength despite high filler content that would otherwise weaken the matrix.
3Temperature
If the blending amount of thermally conductive filler is increased to increase thermal conductivity, then thermal conductivity is improved, but flowability is greatly lowered
Solution Approach 1:
The patent controls the molecular weight of the thermoplastic resin within a specific range (10,000-70,000) to balance flowability and thermal conductivity. This molecular weight optimization ensures the resin has adequate melt flow to accommodate high filler content while maintaining the structural integrity needed for high thermal conductivity.
Solution Approach 2:
The patent optimizes the crystallinity of the thermoplastic resin (30-80%) to improve flowability during molding. By controlling the degree of crystallinity, the resin exhibits better melt flow characteristics that enable adequate flowability even with high thermally conductive filler content, while still achieving the desired thermal conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The approach results in a resin composition with excellent thermal conductivity, improved molding processability, and enhanced fogging resistance and heat resistance, suitable for applications such as heat dissipation in electronic and automotive components.
Implementation Method 1
blending a crystallization accelerator with the thermally conductive resin composition, the crystallization of the thermoplastic resin is accelerated and the thermal conductivity of the thermally conductive filler is exhibited more efficiently
Data Source
Figure 1(a)~2(b)
Figure 3(a)~4(b)
Figure 5(a)~6(b)
AI summary
Provided is a thermally conductive resin composition having a specific gravity of 1.4-2.0 and an In-Plane thermal conductivity of 1 W/(m•K) or higher, and containing at least (A) 30-90% by mass of a thermoplastic resin, (B) 9-69% by mass of an inorganic filler having a thermal conductivity of 1 W/(m•K) or higher, and (C) 0.05-10% by mass of a crystallization accelerator.