LED Sealing Layer B-Stage Bonding for Reliable Encapsulation

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Solution Overview

Problem

Existing methods for producing light-emitting diode (LED) devices often result in damage to the LED elements during the sealing process and inadequate sealing, which compromises the reliability and functionality of the devices.

Innovation Solution

A method involving the preparation of a sealing layer by sealing the LED with a sealing material and a phosphor-containing resin composition that reaches its B-stage, followed by bonding the fluorescent layer to both the sealing layer and the housing surface, ensuring reliable adhesion and preventing spillover of the sealing material.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the LED element is brought into contact with the second layer (fluorescent layer) during the sealing process, then the fluorescent layer can be formed, but the LED element may be damaged due to stress applied during contact

Engineering Contradiction:

ImproveLED element integrityVSAvoidSealing process complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent applies preliminary action by pre-forming the sealing layer with the LED element before bringing in the fluorescent layer. The sealing layer is created first to encapsulate and protect the LED element, establishing a protective barrier in advance that prevents stress damage when the fluorescent layer is subsequently applied.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The sealing layer acts as an intermediary between the LED element and the fluorescent layer. It mediates the interaction by providing a protective interface that isolates the LED element from direct contact with the fluorescent layer, thereby preventing stress transmission while still allowing the fluorescent layer to be properly positioned and cured.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If the LED element is brought into contact with the second layer (fluorescent layer) during the sealing process, then the fluorescent layer can be formed, but the LED element may not be sealed in sufficiently with the second layer

Engineering Contradiction:

ImproveSealing effectivenessVSAvoidSealing layer alignment

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The sealing layer is pre-formed with the LED element before the fluorescent layer is applied. This preliminary sealing action ensures that the LED element is properly encapsulated and positioned, creating a stable foundation that improves sealing effectiveness while reducing the precision requirements for subsequent fluorescent layer application.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent segments the sealing process into two distinct stages: first forming the sealing layer to encapsulate the LED element, then separately applying the fluorescent layer. This segmentation allows each layer to be optimized independently for its specific function, improving overall sealing effectiveness without requiring precise simultaneous alignment of all components.

Inventive Principle:

Principle #1Segmentation

3Strength

If the peripheral end portions of the sealing layer are pressed by both the housing and the fluorescent layer, then the sealing layer is secured in place, but the peripheral end portions may spill over to the outside of the housing

Engineering Contradiction:

ImproveSealing layer adhesionVSAvoidSealing layer geometry

Core Design Contradiction:

StrengthVSShape

Solution Approach 1:

The sealing layer is pre-formed and positioned before the fluorescent layer is applied and cured. This preliminary positioning allows the sealing layer to be properly secured to the housing without the additional constraint of the fluorescent layer, preventing spillover while ensuring adequate adhesion strength.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent applies partial action by allowing the sealing layer to be pressed and adhered to the housing at specific locations (peripheral portions) without requiring uniform compression across the entire sealing layer. This selective pressing ensures adequate adhesion strength at critical locations while avoiding excessive force that would cause spillover.

Inventive Principle:

Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively prevents LED damage and ensures reliable sealing, enhancing the reliability and performance of the light-emitting diode devices by maintaining the integrity of the sealing layer and improving the adhesion of the fluorescent layer.

Implementation Method 1

preparing a fluorescent layer by allowing a phosphor-containing resin composition containing phosphor and silicone resin to reach its B-stage

Methodology Applied

Scientific EffectB-stage transformation:

Data Source

PatentUS8865490B2Method for producing light-emitting diode device

Publication Date: 2014.10.21 ENNOSTAR CORP

AI summary

A method for producing a light-emitting diode device includes a step of preparing a sealing layer by sealing in a light-emitting diode with a sealing material; a step of preparing a fluorescent layer by allowing a phosphor-containing resin composition containing phosphor and silicone resin to reach its B-stage; and a step of bonding the fluorescent layer to the surface of the sealing layer.