LED Package Segmented Reflectors for Light Extraction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional high power LED packages suffer from reduced light extraction efficiency due to interference between light beams emitted from adjacent LED chips, as they are surrounded by a single inclined reflector.
Innovation Solution
The design incorporates a high power LED package with separate first and second reflecting parts, where each LED chip is surrounded by an upward-inclined first reflecting part and the entire package is surrounded by an upward-inclined second reflecting part, preventing beam interference and enhancing light extraction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single inclined reflector surrounds multiple LED chips, then the device complexity is reduced, but light extraction efficiency deteriorates due to beam interference
Solution Approach 1:
The single reflector is divided into multiple separate reflectors, each positioned around individual LED chips. This segmentation prevents light beam interference between adjacent chips while maintaining manageable device complexity through modular construction.
2Loss of energy
If multiple separate reflectors are used for each LED chip, then light extraction efficiency is improved by preventing beam interference, but device complexity increases
Solution Approach 1:
Multiple individual reflectors are merged into a single integrated reflector structure that provides separate reflecting surfaces for each LED chip. This combining approach maintains the light isolation benefits while reducing the number of discrete components and simplifying assembly.
3Productivity
If LED chips are mounted in close proximity to increase luminance, then productivity and light output are improved, but light beam interference increases reducing extraction efficiency
Solution Approach 1:
The reflector system is segmented into chip-specific zones that optically isolate each LED chip's light emission. This allows LED chips to be positioned in close proximity for high luminance output while preventing harmful beam interference through dedicated reflecting surfaces for each chip.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly increases light extraction efficiency by reflecting and focusing light beams, reducing interference and enhancing overall light output.
Implementation Method 1
the package body comprises at least one first reflecting part separately surrounding each of the plurality of light emitting diode chips with upward-inclined inner side walls
Implementation Method 2
a second reflecting part surrounding the entire plurality of light emitting diode chips with an upward-inclined inner side wall
Data Source
AI summary
A high power Light Emitting Diode (LED) package and a method of producing the same. The high power LED package according to the present invention includes a plurality of light emitting diode chips, a first lead frame with the light emitting diode chips mounted thereon, and a second lead frame disposed at a predetermined interval from the first lead frame. The LED package also includes a package body fixing the first and second lead frames and bonding wires for electrically connecting the plurality of LED chips with upward-inclined inner side walls thereof and a second reflecting part surrounding the entire plurality of LED chips with an upward-inclined inner side wall thereof.