LED Packages with Selective Light-Altering Materials
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Solution Overview
Problem
Conventional LED packages face challenges in producing high-quality light with desired emission characteristics while maintaining high light emission efficiency due to light loss and non-uniformity caused by interactions between light emissions and package elements.
Innovation Solution
Selectively placing light-altering materials along the peripheral edges of LED chips and submounts, allowing them to redirect laterally propagating light without covering the entire submount surface, and using a method involving droplet dispensing and wicking to minimize material usage while achieving desired light redirection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If light-altering materials are placed on the entire submount surface, then light redirection is improved, but material usage and cost increase
Solution Approach 1:
The patent applies local quality by placing light-altering materials selectively only at specific locations where light redirection is most needed (peripheral edges of LED chips and adjacent submount areas) rather than uniformly across the entire submount surface. This localized placement maintains effective light redirection while significantly reducing material consumption and cost.
Solution Approach 2:
The patent segments the submount surface into distinct zones: areas requiring light-altering material (peripheral edges adjacent to LED chips) and areas where material is not needed (central and distant regions). This segmentation allows precise material placement only where it provides functional benefit, optimizing both performance and resource efficiency.
2Quantity of substance
If light-altering materials are selectively placed to reduce material usage, then material cost decreases, but light redirection effectiveness may be compromised
Solution Approach 1:
The patent identifies and targets specific peripheral edge regions where light-altering material provides maximum light redirection benefit. By concentrating material placement in these high-impact zones rather than distributing it uniformly, the patent maintains effective light redirection control while using significantly less material.
Solution Approach 2:
The patent extracts and removes light-altering material from regions where it provides minimal or redundant function (central submount areas far from LED chips) while retaining it in critical peripheral regions. This extraction approach eliminates unnecessary material usage while preserving the essential light redirection functionality at the edges where it is most needed.
3Ease of manufacture
If conventional LED packages use standard light-altering material placement, then manufacturing is simple, but light emission uniformity deteriorates due to light loss
Solution Approach 1:
The patent addresses light emission uniformity by applying light-altering materials locally at peripheral edges where light loss occurs most significantly. This targeted approach compensates for edge-related light losses without requiring complex manufacturing processes, maintaining simplicity while improving uniformity.
Solution Approach 2:
The patent converts the harmful effect of light loss at peripheral edges into a beneficial outcome by strategically placing light-altering materials in these same peripheral regions. The materials redirect previously lost lateral light emissions back toward useful directions, transforming the edge regions from problem areas into zones of improved light utilization and uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances light emission efficiency and uniformity by reducing light loss and allowing for precise control over light emission patterns, improving the overall performance of LED packages.
Implementation Method 1
light-altering materials may be provided in reduced amounts while still redirecting laterally propagating light from the LED chips
Implementation Method 2
light-altering materials arranged along peripheral edges of LED chips and along portions of underlying submounts
Implementation Method 3
selectively dispensing one or more droplets on submount portions that are proximate LED chip edges and allowing the one or more droplets to wick about the LED chip edges and portions of the submount
Data Source
AI summary
Light-emitting diode (LED) packages and more particularly LED packages with selectively placed light-altering materials and related methods are disclosed. Selectively placed light-altering materials are provided that are arranged along peripheral edges of LED chips and along portions of underlying submounts. By covering peripheral edges of LED chips without covering entire submount surfaces, light-altering materials may be provided in reduced amounts while still redirecting laterally propagating light from the LED chips. Methods of selectively placing light-altering materials include selectively dispensing one or more droplets on submount portions that are proximate LED chip edges and allowing the one or more droplets to wick about the LED chip edges and portions of the submount before curing in place.