Semiconductor LED Self-Assembly Fixation Using UV-Cured Insulator
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Solution Overview
Problem
Existing display devices using semiconductor light emitting devices face challenges in effectively fixing the devices to a substrate during the self-assembly process, which can lead to instability and separation of the devices from the substrate.
Innovation Solution
A method involving the application of a photosensitive organic insulator on the semiconductor light emitting devices and the substrate, followed by exposure and curing, to securely fix the devices to the substrate without applying pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If semiconductor light emitting devices are assembled to the substrate using an electromagnetic field, then the assembly process becomes automated and efficient, but the devices cannot be effectively fixed to the substrate leading to instability and separation
Solution Approach 1:
A photosensitive organic insulator is applied in advance to the substrate before assembling the semiconductor light emitting devices. This preliminary application ensures that the fixing material is already in place to provide stable fixation after the devices are assembled using electromagnetic field, preventing subsequent separation or instability.
Solution Approach 2:
The photosensitive organic insulator serves as an intermediary material between the semiconductor light emitting devices and the substrate. It is applied to the substrate and the space between devices, and after UV exposure and curing, it chemically bonds to both surfaces, providing reliable mechanical and chemical fixation that bridges the devices to the substrate.
2Strength
If pressure is applied to fix the semiconductor light emitting devices to the substrate, then the fixing strength increases, but deformation or damage occurs to the devices
Solution Approach 1:
The patent replaces the mechanical pressure-based fixation system with a photochemical fixation system. Instead of applying mechanical pressure to bond the devices to the substrate, a photosensitive organic insulator is applied and then cured by UV exposure, which causes chemical bonding without mechanical stress, thereby achieving strong fixation without deformation or damage.
Solution Approach 2:
The fixing mechanism transitions from mechanical parameters (pressure, force) to chemical parameters (photochemical reaction, curing). The photosensitive organic insulator undergoes a parameter change when exposed to UV light, transforming from a liquid or paste state to a solidified, cross-linked state that provides strong bonding without requiring mechanical pressure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively secures semiconductor light emitting devices to the substrate, preventing deformation or damage due to pressure, and ensures stable assembly even in large-screen high-pixel displays.
Implementation Method 1
a photosensitive organic insulator applied to a space between the semiconductor light emitting device and the substrates and between the pair of assembly electrodes to fix the semiconductor light emitting device to the substrate
Implementation Method 2
a self-assembly method in which semiconductor light emitting devices injected into a fluid are moved to a substrate using an electromagnetic field
Data Source
AI summary
A display device according to an example of the present disclosure includes a pair of assembly electrodes spaced apart from each other on a substrate, a semiconductor light emitting device assembled on the pair of assembly electrodes, a photosensitive organic insulator applied to a space between the semiconductor light emitting device and the substrate and between the pair of assembly electrodes to fix the semiconductor light emitting device to the substrate, and an insulating layer disposed between the pair of assembly electrodes and the semiconductor light emitting device.