3D Substrate Wiring for Compact LED Series-Parallel Arrays
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Solution Overview
Problem
Conventional light-emitting devices with multiple light-emitting elements connected in series and parallel experience an increase in size due to the number of wires required, leading to a larger device footprint.
Innovation Solution
A light-emitting device design featuring a substrate with multiple surfaces for conductive members and element mounting portions, allowing at least four light-emitting elements to be connected in series and parallel with reduced wire usage, utilizing flip-chip mounting and recessed wiring to minimize size and prevent short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple light-emitting elements are connected in series and parallel with conventional wiring methods, then the electrical connection is achieved, but the number of wires increases leading to larger device size
Solution Approach 1:
The patent utilizes the lateral surfaces (third and fourth surfaces) of the substrate in addition to the top and bottom surfaces, effectively using three-dimensional space for wire routing. This allows wires to be arranged on multiple surfaces rather than being confined to a single plane, reducing the number of wires needed and minimizing device footprint while achieving proper series-parallel electrical connections between light-emitting elements.
Solution Approach 2:
The patent employs a multi-layered wiring structure where wires are arranged on different surfaces (first, second, third, and fourth surfaces) of the substrate, creating a nested three-dimensional wiring architecture. This nested arrangement allows electrical connections to be made with fewer external wires while maintaining series-parallel connectivity, thereby reducing device size.
2Reliability
If more wires are used to connect light-emitting elements in series and parallel, then proper electrical connection is ensured, but the device footprint increases
Solution Approach 1:
The patent extends wire routing into the third dimension by utilizing lateral surfaces of the substrate. Wires are arranged on the third surface extending in the first direction and on the fourth surface, creating a vertical stacking effect that reduces the horizontal footprint of the device while maintaining necessary electrical connections for series-parallel configurations.
Solution Approach 2:
The patent merges multiple wiring functions into a integrated substrate structure where the substrate itself serves as the wiring carrier. Multiple wires are combined and routed through different surfaces of the same substrate, eliminating the need for separate external wiring harnesses and reducing overall device footprint.
Data Source
AI summary
A light-emitting device includes a substrate having a first surface extended in a first direction, a second surface opposite to the first surface, a third surface between the first and second surfaces and extended in the first direction, and a fourth surface opposite to the third surface, a conductive member including at least four element mounting portions arranged in the first direction on the first surface, a first wiring portion on the second surface, a second wiring portion on the third surface, and a third wiring portion on the fourth surface, and first, second, third, and fourth light-emitting elements respectively mounted on the four element mounting portions. With the first, second, and third wiring portions, the first and second light-emitting elements are connected in series, the third and fourth light-emitting elements are connected in series, and the first and third light-emitting elements are connected in parallel.