Light Emitting Device Shielding Layer for Laser Lift-Off Protection
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Solution Overview
Problem
The laser lift-off process for removing sapphire substrates in light emitting devices can damage circuit control boards due to penetration of laser light, which is not effectively addressed by existing technologies.
Innovation Solution
A light emitting device with a shielding layer connected to the light emitting structure to absorb or reflect incident laser light, preventing damage to the circuit control board, and a sacrifice structure to prevent crack propagation during removal, along with a control circuit and electrodes for high resolution and structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a laser lift-off process is used to remove sapphire substrates, then the sapphire substrate can be effectively removed, but the laser light penetrates through the substrate and damages the circuit control board underneath
Solution Approach 1:
A sacrificial layer is introduced between the sapphire substrate and the circuit control board. This intermediary layer absorbs the laser energy and prevents it from reaching the circuit board, while still allowing the substrate removal process to proceed effectively.
Solution Approach 2:
The patent converts the harmful laser penetration into a beneficial effect by using the laser energy to selectively remove the sacrificial layer. The laser that would otherwise damage the circuit board is instead used to etch away the sacrificial material, protecting the underlying electronics.
2Volume of moving object
If the space between light emitting structures is reduced for miniaturization, then device size is reduced and resolution is improved, but structural stability and crack resistance deteriorate
Solution Approach 1:
The patent applies different material properties and structural characteristics to different regions of the device. The sacrificial layer is strategically positioned in specific areas to provide localized support and crack prevention, while allowing miniaturization in other regions. This localized approach maintains structural stability without preventing device shrinkage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The shielding layer effectively absorbs or reflects laser light, preventing damage to the circuit control board, while the sacrifice structure and control circuit enhance structural stability and resolution of the light emitting device.
Implementation Method 1
The shielding layer is connected to a side of the light emitting structure and is adapted to absorb or reflect incident laser light
Implementation Method 2
The shielding layer is connected to a side of the light emitting structure and is adapted to absorb or reflect incident laser light
Data Source
AI summary
A light emitting device includes a light emitting structure, first and second electrodes, and a shielding layer. The light emitting structure includes a first-type semiconductor layer, an active layer, and a second-type semiconductor layer that are stacked along a stacking direction in such order. The first electrode is electrically connected to the first-type semiconductor layer. The second electrode is electrically connected to the second-type semiconductor layer. The shielding layer is connected to aside of the light emitting structure and is adapted to absorb or reflect incident laser light.