LED Side Surface Electrode Connections via Conductive Adhesive
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Solution Overview
Problem
The manufacturing process for light-emitting devices is complex and costly due to the difficulty in forming via-holes in non-conductive substrates, which complicates the formation of electrode connections and increases production expenses.
Innovation Solution
A method involving the formation of electrode connection layers on the side surfaces of a non-conductive substrate using a conducting adhesive layer, with an insulating film to prevent short-circuiting, and a package with a conductive adhesive layer to connect the electrodes, facilitating the manufacturing process and reducing costs by eliminating the need for via-holes in the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If via-holes are formed in non-conductive substrates to create electrode connections, then electrical connections between electrodes can be established, but the manufacturing process becomes complex and costly
Solution Approach 1:
The patent transitions from forming via-holes in the vertical direction through the non-conductive substrate to forming electrode connection layers on the horizontal side surfaces of the substrate. This dimensional change eliminates the need for complex via-hole formation while achieving the same electrical connection function through lateral contact between the conducting adhesive layer and electrode layers on the side surfaces.
2Reliability
If via-holes are formed in non-conductive substrates to create electrode connections, then electrical connections between electrodes can be established, but production costs increase
Solution Approach 1:
The patent transitions from forming via-holes in the vertical direction through the non-conductive substrate to forming electrode connection layers on the horizontal side surfaces of the substrate. This dimensional change eliminates the need for complex via-hole formation while achieving the same electrical connection function through lateral contact between the conducting adhesive layer and electrode layers on the side surfaces.
3Ease of manufacture
If electrode connection layers are formed on side surfaces of non-conductive substrates, then the manufacturing process is simplified and costs are reduced, but additional structural elements are required
Solution Approach 1:
The conducting adhesive layer serves multiple functions simultaneously: it provides electrical connection between the electrode layers and the non-conductive substrate, acts as an adhesive bonding layer, and enables the simplified side-surface connection approach. This multi-functionality reduces the need for separate connection structures while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process and reduces costs by allowing electrode formation on the side surfaces of the substrate, enhancing the efficiency and reliability of light-emitting device production while maintaining effective electrical connections.
Implementation Method 1
a conducting adhesive layer which is formed on a top surface of a non-conductive substrate and connects the non-conductive substrate to the first electrode layer and the insulating layer
Implementation Method 2
an insulating layer which is coated on a portion other than portions where the first electrode layer and the second electrode layer are located
Implementation Method 3
Light-emitting devices, such as light-emitting diodes (LEDs), refer to semiconductor devices that may create various colors of light by constituting a light source through a PN junction of a compound semiconductor
Data Source
AI summary
An LED includes a compound semiconductor structure having first and second compound layers and an active layer, first and second electrode layers atop the second compound semiconductor layer and connected to respective compound layers. An insulating layer is coated in regions other than where the first and second electrode layers are located. A conducting adhesive layer is formed atop the non-conductive substrate, connecting the same to the first electrode layer and insulating layer. Formed on one side surface of the non-conductive substrate and adhesive layer is a first electrode connection layer connected to the conducting adhesive layer. A second electrode connection layer formed on another side surface is connected to the second electrode layer. By forming connection layers on respective side surfaces of the light-emitting device, manufacturing costs can be reduced.