Semiconductor LED Packaging with Inclined Side Surfaces
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Solution Overview
Problem
Semiconductor light-emitting devices face issues with light emission efficiency and color deviation due to light loss and total internal reflection during the packaging process.
Innovation Solution
The semiconductor light-emitting device incorporates a side surface inclined portion with a light-transmitting resin containing a wavelength conversion or light dispersing material, and a side surface reflection portion with a reflective powder, along with a wavelength conversion film and a light-transmitting adhesive layer, to reduce light loss and enhance light extraction efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional LED packaging is used, then the device structure is simple and easy to manufacture, but light loss and total internal reflection occur causing deteriorated light emission efficiency and color deviation
Solution Approach 1:
The packaging structure is segmented into multiple functional components: a package body with a bottom surface, a side surface inclined portion with specific inclination angle, a wavelength conversion film, and a light-transmitting adhesive layer. This segmentation allows each component to address specific optical issues independently while working together to improve overall light extraction efficiency.
Solution Approach 2:
The side surface inclined portion is designed with a specific inclination angle (e.g., 45 degrees) to locally modify light reflection characteristics. The wavelength conversion film is positioned specifically on the second surface to convert wavelengths locally. These localized quality modifications address total internal reflection and color deviation issues without requiring complete structural redesign.
2Device complexity
If conventional packaging without wavelength conversion control is used, then the device structure is simple, but color deviation occurs due to light loss
Solution Approach 1:
The wavelength conversion film is applied in advance on the second surface of the LED chip before final packaging assembly. This preliminary wavelength conversion action ensures that light is converted to the desired wavelength range before exiting the package, preventing color deviation from occurring in the first place rather than correcting it afterward.
Solution Approach 2:
The light-transmitting adhesive layer serves as an intermediary between the LED chip and the package body, allowing light to pass through while maintaining optical coupling. This intermediary layer helps control light transmission characteristics and works in conjunction with the wavelength conversion film to maintain color consistency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces light loss from total internal reflection and improves light extraction efficiency while minimizing color deviation, resulting in enhanced luminous efficiency and color rendering properties.
Implementation Method 1
a wavelength conversion film disposed on the second surface
Implementation Method 2
disadvantageous effects such as deteriorations of light emission efficiency or increase in color deviation may occur in a product due to light loss and total internal reflection caused by other components
Implementation Method 3
a side surface reflection portion which is disposed on the mounting surface of the package substrate to surround the side surface inclined portion and includes the inwardly inclined surfaces by contacting the side surface inclined portion. The inwardly inclined surfaces may be used to guide light emitted from the semiconductor LED chip toward the wavelength conversion film
Data Source
AI summary
A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor LED chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.