LED Sidewall Conductive Structures for Light Extraction
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Solution Overview
Problem
Conventional light-emitting diode devices face challenges in high light extraction efficiency due to opaque structures like electrodes and conductive connecting structures, which reduce the effectiveness of light emission.
Innovation Solution
The light-emitting diode device features a substrate with light-emitting diode units having conductive connecting structures arranged on the sidewalls, with varying lengths and spatial separation to minimize light shading, and a substrate material like sapphire or lithium aluminum oxide, enhancing light extraction efficiency by reducing redundant electrode extensions and improving current spreading.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive connecting structures are formed to electrically connect light-emitting diode units, then electrical connectivity is achieved, but light extraction efficiency deteriorates due to light shading by opaque structures
Solution Approach 1:
The conductive connecting structures are moved from a planar configuration to a three-dimensional configuration by forming them on the sidewalls of the light-emitting diode units. This dimensional transition allows the conductive structures to be positioned above the light extraction surface rather than blocking it from above, thereby maintaining electrical connectivity while minimizing light shading.
Solution Approach 2:
The conductive connecting structures are segmented into multiple portions distributed along the sidewalls of the light-emitting diode units. This segmentation allows the conductive material to be distributed in a way that provides adequate electrical connectivity while minimizing the total cross-sectional area blocking light extraction paths.
2Reliability
If conventional conductive connecting structures with electrode extensions are used, then electrical connection is established, but manufacturing complexity increases due to deep gaps requiring precise alignment
Solution Approach 1:
By forming conductive connecting structures on the sidewalls of the light-emitting diode units, the patent eliminates the need to bridge deep horizontal gaps between adjacent units. This vertical positioning on sidewalls simplifies the manufacturing process by avoiding precise alignment requirements across deep gaps, thereby reducing manufacturing complexity.
3Ease of manufacture
If uniform conductive connecting structures are used on all sidewalls, then manufacturing is simplified, but current spreading becomes non-uniform affecting device performance
Solution Approach 1:
The patent applies different configurations of conductive connecting structures to different sidewalls of the light-emitting diode units. Specifically, the first sidewall has a different number of conductive connecting structures compared to the second sidewall. This local differentiation allows optimization of current spreading patterns to match the specific geometric and electrical requirements of each sidewall, thereby achieving uniform current distribution across the device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases light extraction efficiency by reducing the light shading area and improving current spreading, resulting in enhanced performance compared to conventional devices.
Implementation Method 1
Each stack 120 of the light-emitting diode units 12 comprises a first semiconductor layer 121, an active layer 122, and a second semiconductor layer 123
Data Source
AI summary
A LED device includes a substrate; a plurality of LED units on the substrate, wherein each LED unit includes: a first semiconductor layer; a second semiconductor layer; a first sidewall; a second sidewall opposite to the first sidewall; and a third sidewall connecting the first and second sidewalls; a first group of conductive connecting structure including n (n is an integer, and n>1) first conductive connecting structures formed on the first sidewall of one of the LED units and electrically connecting the LED units; and a second group of conductive connecting structure including m (m is an integer, m≥1, and n≠m) second conductive connecting structures formed on the second sidewall of the same one of the LED unit and electrically connecting the LED units; wherein each of the first and the second conductive connecting structures includes a middle part, a first and a second extending parts; wherein the first and the second extending parts have different length.