Packaged LED Structure with Sloped Resin Base for Enhanced Illumination
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Solution Overview
Problem
Conventional white light sources in projectors are bulky, inefficient, and result in increased size and power consumption, while LED projectors face issues with poor brightness and wire damage during packaging, which affects image resolution and illumination.
Innovation Solution
A packaged LED structure with exposed emitting chips and a specific resin base design that allows the wires to be below the outer wall, using a transparent or translucent glue to enhance illumination by preventing light interference and protecting the wires during processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional white light sources (high pressure halogen lamps or mercuric lamps) are used in projectors, then the projectors can achieve sufficient brightness, but the projectors become bulky and consume more power
Solution Approach 1:
The patent transitions from conventional white light sources to LED technology, fundamentally changing the light generation mechanism. LEDs convert electrical energy to light more efficiently, reducing power consumption while maintaining adequate brightness for projection applications
Solution Approach 2:
The invention replaces the thermal radiation mechanism of halogen and mercuric lamps with the electroluminescence mechanism of LEDs. This substitution eliminates the need for high-temperature operation and bulky optical components, achieving compact size and lower power consumption
2Reliability
If the resin base outer wall is kept low to protect wires, then wire damage is prevented, but the emitting chip cannot be properly exposed and illumination is reduced
Solution Approach 1:
The resin base is divided into distinct functional zones: an outer wall for mechanical protection and wire support, and an inner wall with a lower top surface for chip exposure. This segmentation allows each zone to fulfill its specific function without compromising the other
Solution Approach 2:
The resin base exhibits different structural characteristics in different regions. The outer wall maintains sufficient height for wire protection, while the inner wall is lowered to expose the emitting chip surface. This local differentiation resolves the contradiction between protection and illumination
3Volume of moving object
If LEDs are used as white light sources, then the projector size and power consumption are reduced, but the brightness is insufficient resulting in poor image resolution ratio
Solution Approach 1:
The patent introduces a curved reflective surface at the bottom of the resin base cavity. This curved surface acts as a reflector that redirects light from the LED chip upward through the projection lens, maximizing light extraction efficiency and improving projection brightness despite the compact LED size
Solution Approach 2:
The invention utilizes the vertical dimension by creating a cavity structure with curved reflective surfaces. Light that would otherwise be lost in downward or lateral directions is redirected through the lens system, effectively increasing the usable light output from the compact LED source
4Reliability
If glue is filled into the resin base to package the emitting chip, then the chip is protected, but the glue forms a lens that influences light emission and reduces illumination
Solution Approach 1:
The patent extracts the protective function from the bulk glue material and concentrates it at the chip-submount interface. By minimizing the glue volume and positioning it only where mechanical bonding is required, the harmful lensing effect is eliminated while maintaining chip protection and electrical connection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the illumination and reduces wire damage, leading to improved projector quality and portability by using LEDs as a white light source, offering better brightness and resolution.
Implementation Method 1
Light emitting diode comprising: a lead frame has a plurality of electrode portions thereon
Implementation Method 2
an emitting chip attached on the top surface(s) of one or two the electrode portion(s), the emitting chip having a top surface, a bottom surface
Implementation Method 3
a glue filled into a space between the emitting chip and the inner wall, the glue having a surface portion between the first corner line of the inner wall and the second corner line of the emitting chip to expose the top surface of the emitting chip
Data Source
AI summary
A light emitting diode is provided. The light emitting diode comprises a lead frame, a resin base, an emitting chip and a glue. The lead frame has a plurality of electrode portions thereon. The resin base is provided on the lead frame, the resin base having an outer wall thereon and around an edge to form an opening, and the opening exposing the electrode portions; and an inner wall extending from the outer wall, and the inner side of the inner wall has a slope to decrease the inner diameter of the opening gradually. The emitting chip is attached on the top surface(s) of one or two the electrode portion(s). The glue is filled into a space between the emitting chip and the inner wall to expose the top surface of the emitting chip. Therefore, the illumination of the light emitting diode can be enhanced.