LED Circuit Stack With Split Conductive Layer for Side-Free Interconnects
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Solution Overview
Problem
Existing methods for manufacturing optoelectronic devices with light-emitting diodes face challenges in forming electrodes on the sides of the devices, which is a difficult step and affects the efficiency and reliability of the devices.
Innovation Solution
The solution involves a stack of a first circuit with an inorganic light-emitting diode and a second circuit for control, where an electrically-conductive layer is divided orthogonally, with electrodes electrically coupled to conductive pads through separate portions of this layer, and an electrical insulation trench separates the conductive pads and the second circuit, allowing for improved electrical insulation and connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrodes are formed covering the sides of the optoelectronic devices, then electrical connection is achieved, but the manufacturing process becomes difficult to implement
Solution Approach 1:
The conductive layer is divided into first and second portions orthogonally to the stacking direction, with each portion serving a specific electrical connection function. This segmentation allows electrodes to be formed only where necessary (on the first surface) rather than covering entire side surfaces, simplifying the manufacturing process while maintaining reliable electrical connection.
Solution Approach 2:
The patent extracts the electrode formation step from the side surfaces and concentrates it only on the first surface of the first circuit. By removing the requirement to form electrodes on the sides, the manufacturing complexity is reduced while the essential electrical connection function is preserved through the divided conductive layer structure.
2Ease of manufacture
If a single conductive layer is used to connect electrodes to pads, then manufacturing is simplified, but electrical insulation between different circuits is compromised
Solution Approach 1:
The conductive layer is segmented into distinct first and second portions that are spatially separated. This segmentation allows each portion to independently serve its electrical connection function without interfering with the other, while the insulation trench maintains electrical isolation between the first and second circuits.
Solution Approach 2:
An electrical insulation trench is introduced as an intermediary element between the first and second circuits. This trench physically separates the conductive portions and prevents electrical interference, allowing the conductive layer to maintain its manufacturing simplicity while achieving the necessary electrical insulation through the introduced insulating structure.
3Strength
If high-temperature bonding is used to assemble circuits, then strong bonding is achieved, but substrate damage risk increases
Solution Approach 1:
The patent changes the bonding parameter from high temperature to low temperature bonding. This parameter change allows the assembly of the first and second circuits without exposing the substrate to temperatures that could cause damage, while still achieving sufficient bonding strength through the direct contact assembly method.
Data Source
AI summary
An optoelectronic device including a first circuit including at least one light-emitting diode emitting through a first surface of the first circuit and including first and second electrodes; a second circuit for controlling the light-emitting diode, positioned on a second surface of the first circuit opposite to the first surface, including first and second electrically-conductive pads; and an electrically-conductive layer located at the interface between the first and second circuits, the electrically-conductive layer being divided into first and second portions orthogonally to the stack of the first and second circuits, the first electrode being electrically coupled to the first conductive pad via the first portion of the conductive layer and the second electrode being electrically coupled to the second conductive pad via the second portion of the conductive layer.