LED Sub-chip Groove Bridge Electrode Voltage Handling
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Solution Overview
Problem
High-voltage LED chips have low luminous efficiency due to their inability to effectively handle higher voltages, limiting their luminosity compared to previous generations of LED chips.
Innovation Solution
The development of an LED device with a groove between sub-chips, a bridge insulating layer, and a bridge electrode that connects electrodes, along with a textured surface design to enhance light emission efficiency, increases the light emission area and improves luminous efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high-voltage LED chips are developed to increase luminosity, then the voltage handling capability is improved, but the luminous efficiency deteriorates
Solution Approach 1:
The LED chip is divided into multiple sub-chips (first LED sub-chip and second LED sub-chip) separated by a groove. This segmentation allows each sub-chip to be optimized independently while collectively achieving high voltage handling capability and maintained luminous efficiency through the bridge electrode connection structure.
Solution Approach 2:
Different regions of the LED chip are given different properties: the groove region provides electrical isolation and structural support, the bridge insulating layer provides electrical connection with insulation, and the textured sidewall region enhances light extraction. This local differentiation optimizes both voltage handling and luminous efficiency in their respective zones.
2Loss of energy
If the light emission area is increased to improve luminous efficiency, then the luminosity is improved, but the device complexity increases
Solution Approach 1:
Multiple functions are merged into single structures: the groove serves both as an electrical isolator and a structural separator; the bridge insulating layer combines electrical connection and insulation functions; the textured sidewall simultaneously provides structural definition and light extraction enhancement. This merging increases light emission area without proportionally increasing device complexity.
Solution Approach 2:
The groove structure serves multiple purposes: electrical isolation between sub-chips, mechanical support for the bridge insulating layer, and definition of the light emission area. The bridge electrode similarly provides both electrical connection and structural bridging functions, maximizing the utility of each structural element.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced LED chip design improves luminous efficiency while reducing production costs by structurally increasing the light emission area, effectively addressing the low efficiency of previous high-voltage LED chips.
Implementation Method 1
LED is commonly referred to as a cold light source with significant advantages over incandescent sources
Implementation Method 2
a texture of the second surface is less granular than a texture of the first surface
Data Source
AI summary
A light-emitting diode (LED) sub-chip and a method of producing the same are provided. The LED sub-chip comprises an epitaxial layer disposed on a growth substrate, where the epitaxial layer comprises a plurality of electrodes. The groove disposed between the LED sub-chip and a second LED sub-chip, where the groove penetrates through the epitaxial layer separating the two sub-chips. The bridge insulating layer at least partially covering a sidewall of the groove, where the sidewall comprises a first surface and a second surface above the first surface, where the texture of the second surface is less granular than a texture of the first surface. The bridge electrode on the bridge insulating layer, where the bridge electrode connects respective electrodes of the two sub-chips at the first surface.