LED Pad Sub-Pad Layout for Flexible Multi-Circuit Connections
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Solution Overview
Problem
Light emitting diode packages face design difficulties and inefficient space utilization due to the need for separate wires to connect multiple LEDs in series, parallel, or series-parallel configurations, which complicates circuit arrangement and affects temperature management and reliability.
Innovation Solution
A light emitting apparatus with a base substrate featuring multiple circuits and a pad structure that allows for efficient series, parallel, or series-parallel connections through sub-pads, incorporating light emitting sources with different peak wavelengths, wavelength converters, and integrated circuits for improved color gamut and reliability, along with a reflector for enhanced light extraction and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate wires are used to connect multiple LEDs in series, parallel, or series-parallel configurations, then the desired connection flexibility is achieved, but design difficulty increases and space utilization becomes inefficient
Solution Approach 1:
The pad structure is segmented into multiple sub-pads (first sub-pad, second sub-pad, third sub-pad, fourth sub-pad) that can be independently configured to create different connection patterns. This segmentation allows the same physical structure to achieve series, parallel, or series-parallel connections without requiring separate wire designs for each configuration.
Solution Approach 2:
The pad structure with multiple sub-pads serves multiple functions: it can create series connections, parallel connections, or series-parallel connections depending on how the sub-pads are configured and connected. This universal design eliminates the need for different wire arrangements for different connection types, reducing design complexity while maintaining connection flexibility.
2Adaptability or versatility
If separate wires are used to connect multiple LEDs, then connection configurations are achieved, but space utilization in the package becomes inefficient
Solution Approach 1:
Multiple connection functions are merged into a single integrated pad structure. Instead of using separate wires that would occupy different spatial paths, the invention combines series and parallel connection capabilities into one compact pad assembly with multiple sub-pads, significantly improving space utilization within the LED package.
Solution Approach 2:
The connection architecture transitions from a two-dimensional wire layout on the package surface to a multi-dimensional pad structure where sub-pads are arranged in specific patterns (with certain sub-pads facing each other). This dimensional reorganization allows more efficient use of available space while maintaining all required connection configurations.
3Area of stationary object
If multiple circuits with light emitting sources are integrated on a base substrate, then space utilization improves and color expression expands, but operation temperature increases and reliability decreases
Solution Approach 1:
The integrated circuit structure is segmented into multiple independent circuits, each with its own light emitting sources and associated pads. This segmentation allows for better thermal management by distributing heat generation across separate circuit regions rather than concentrating it in a single area, thereby maintaining reliability while achieving compact integration.
Solution Approach 2:
Different regions of the base substrate are assigned different functions: some regions house light emitting sources while others contain pad structures for electrical connections. This local differentiation optimizes each region for its specific purpose, allowing efficient space utilization while managing thermal characteristics and electrical performance independently in each zone.
4Productivity
If sub-pads are arranged to face each other for series, parallel, or series-parallel connections, then connection efficiency improves, but manufacturing precision requirements increase
Solution Approach 1:
The sub-pads are arranged in an asymmetric pattern where certain sub-pads face each other in specific orientations. This asymmetric arrangement is optimized for efficient electrical connection while being compatible with standard manufacturing processes. The facing configuration reduces the number of connection steps required compared to symmetric alternatives, improving productivity without requiring excessive manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient space utilization, reduced operation temperature, improved reliability, and a wide range of color expression with increased light extraction efficiency, facilitating complex circuit configurations and enhanced protection from external factors.
Implementation Method 1
incorporating light emitting sources with different peak wavelengths, wavelength converters
Implementation Method 2
along with a reflector for enhanced light extraction
Data Source
Figure 1(a)~1(b)
Figure 2~3
Figure 4~5
AI summary
A light emitting apparatus is disclosed. The light emitting apparatus includes: a plurality of circuits disposed on a base substrate; one or more light emitting sources in at least a circuit among the plurality of circuits; and a pad disposed under the base substrate and contacting one electrode and the other electrode of each of the plurality of circuits, wherein the pad includes: a first sub-pad contacting one electrode of a first circuit among the plurality of circuits, a third sub-pad contacting the other electrode of the first circuit, a second sub-pad contacting one electrode of a second circuit among the plurality of circuits, and a fourth sub-pad contacting the other electrode of the second circuit, and at least a region of one surface of the second sub-pad is disposed to face at least a region of one surface of the third sub-pad.