Light Emitting Element Substrate Bonding Throughput
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Solution Overview
Problem
The manufacturing of light-emitting elements using small substrates limits throughput and increases costs due to the need for specialized equipment, making it difficult to reduce production expenses and improve efficiency.
Innovation Solution
A method of manufacturing light-emitting elements involves forming conductive and light-emitting layers on a small substrate, bonding it to a larger substrate, and then etching to expose layers, allowing for the use of equipment designed for larger substrates, thereby increasing throughput and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If small substrates are used to manufacture light-emitting elements, then manufacturing can be performed with existing equipment, but throughput is reduced and manufacturing costs increase
Solution Approach 1:
The manufacturing process is divided into two distinct stages: first, light-emitting elements are fabricated on small substrates using existing equipment; second, multiple small substrates are bonded together on a large carrier substrate to create a consolidated product. This segmentation allows each stage to use appropriately sized equipment, maintaining manufacturability while achieving high throughput through batch processing.
Solution Approach 2:
Multiple small substrates containing light-emitting elements are bonded and nested onto a single large carrier substrate. This nesting approach allows numerous individually manufactured elements to be consolidated into one large unit, enabling the use of large-substrate equipment for subsequent processing steps and significantly improving throughput without sacrificing the manufacturability benefits of small-substrate fabrication.
2Ease of manufacture
If small substrates are used to manufacture light-emitting elements, then existing equipment can be utilized, but manufacturing costs increase
Solution Approach 1:
Multiple small substrates that have been individually manufactured using existing equipment are bonded together on a large carrier substrate. This merging consolidates numerous small units into one large assembly, enabling subsequent processing steps to be performed on the consolidated unit rather than on each small substrate separately. This reduces the total number of processing cycles required and lowers manufacturing costs while maintaining compatibility with existing small-substrate fabrication equipment.
Solution Approach 2:
The large carrier substrate serves multiple functions: it acts as a support structure during the bonding of small substrates, provides a platform for consolidated processing of multiple elements simultaneously, and enables the use of large-substrate equipment for downstream operations. This multi-functionality reduces the need for specialized small-substrate equipment throughout the entire manufacturing process, thereby reducing overall manufacturing costs.
3Reliability
If small substrates are used, then light-emitting elements can be fabricated with current technology, but specialized equipment is required limiting scalability
Solution Approach 1:
Instead of attempting to manufacture light-emitting elements directly on large substrates using尚未成熟的 technology, the process inverts the approach by first fabricating elements on small substrates using reliable existing technology, then bonding these small substrates onto a large carrier. This inversion allows the manufacturing process to leverage proven small-substrate fabrication capabilities while achieving the scalability benefits of large-substrate processing through the bonding step.
Solution Approach 2:
The small substrates are prepared and light-emitting elements are fabricated on them in advance using existing reliable equipment. These pre-prepared small substrates are then bonded onto the large carrier substrate in a subsequent step. This preliminary action on small substrates allows the system to benefit from mature fabrication technology while the final large-substrate assembly enables scalable production and future adoption of advanced large-substrate processing equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances manufacturing efficiency by allowing the use of existing large-substrate equipment, reducing production costs and improving the throughput of light-emitting element production.
Implementation Method 1
performing a first annealing on the at least one sapphire substrate
Implementation Method 2
performing a second annealing on the at least one sapphire substrate, and bonding the at least one sapphire substrate to a silicon substrate
Data Source
AI summary
The present invention provides a light-emitting element, a method of manufacturing the light-emitting element, a light-emitting device, and a method of manufacturing the light-emitting device. A method of manufacturing a light-emitting element includes: forming a first conductive layer of a first conductive type, a light-emitting layer, and a second conductive layer of a second conductive type on at least one first substrate, forming an ohmic layer on the second conductive layer and bonding the at least one first substrate to a second substrate. The second substrate being larger than the first substrate. The method further includes etching portions of the ohmic layer, the second conductive layer, and the light-emitting layer to expose a portion of the first conductive layer.