Multi-Path Thermal Management for LED Substrates
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Solution Overview
Problem
Conventional thermal management techniques for solid state light emitting apparatus, such as LEDs, are not effective in at least partially enclosed housings, leading to heat buildup and degradation of device performance and reliability.
Innovation Solution
A mounting substrate with a peripheral and central portion, thermally coupled to the housing through multiple thermal conduction paths, including thermally conductive beams or fibrous pads, to dissipate heat generated by the LEDs, providing both primary and secondary thermal conduction paths for efficient heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If multiple LEDs are placed on a mounting substrate to provide a light emitting apparatus, then the light output is improved, but heat generation increases and thermal management becomes difficult in enclosed housings
Solution Approach 1:
The patent divides the thermal management system into multiple independent thermal conduction paths. The mounting substrate is segmented into a first portion and a second portion, each connected to the housing through separate thermal conduction paths. This segmentation allows heat from multiple LEDs to be distributed and dissipated through different routes, preventing heat accumulation and improving overall thermal management effectiveness.
2Loss of energy
If conventional thermal management techniques such as mounting LEDs on thermally conductive media and using heat sinks are employed, then some heat dissipation is achieved, but effectiveness is insufficient in at least partially enclosed housings
Solution Approach 1:
The patent transitions from conventional single-path thermal management to a multi-dimensional thermal conduction system. By creating multiple thermal conduction paths that extend in different spatial dimensions from the mounting substrate to the housing, the system achieves more effective heat dissipation in enclosed spaces where conventional approaches fail. This dimensional expansion of thermal pathways allows heat to escape through multiple directions simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively dissipates heat away from the LEDs, maintaining performance and reliability by creating multiple thermal paths that redirect heat flow from the center to the periphery of the housing, enhancing heat dissipation in enclosed LED structures.
Implementation Method 1
a housing that is configured to thermally couple to the peripheral portion of the mounting substrate, so as to provide a first thermal conduction path for at least some heat generated by the solid state light emitting elements. A thermal conduction apparatus is configured to thermally couple the central portion of the mounting substrate to the housing, so as to provide a second thermal conduction path
Data Source
AI summary
A mounting substrate includes a peripheral portion and a central portion. Solid state light emitting elements are provided on the mounting substrate. A housing is configured to thermally couple to the peripheral portion of the mounting substrate, so as to provide a first thermal conduction path for at least some heat generated by the solid state light emitting elements. A thermal conduction member is configured to thermally couple the central portion of the mounting substrate to the housing, so as to provide a second thermal conduction path that is different from the first thermal conduction path, for at least some heat generated by the solid state light emitting elements. Related assembling methods are also described.