Stacked LED Substrate with Opening and Reflection Frame
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing light emitting diode (LED) devices face challenges in achieving optimal central luminous intensity, leading to inefficient light distribution and reduced brightness in applications such as lighting displays and image displays.
Innovation Solution
A light emitting apparatus is designed by stacking two substrates with a light emitting device mounted on the lower substrate and forming an opening with three open sides and a double-sided reflection frame on the upper substrate, along with a mold member to enhance light reflection and distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a conventional single-substrate LED packaging structure is used, then the device structure is simple, but the central luminous intensity is insufficient and light distribution is inefficient
Solution Approach 1:
The patent transitions from a conventional single-substrate planar structure to a three-dimensional stacked substrate configuration. The first substrate supports the LED chip while the second substrate is positioned above it with an opening that exposes the LED chip, creating a vertical layered structure that improves light extraction and central luminous intensity without excessive complexity
Solution Approach 2:
The packaging structure is divided into two separate substrates with distinct functions: the first substrate provides mechanical support and electrical connections for the LED chip, while the second substrate provides structural protection and defines the opening for light emission. This segmentation allows optimization of each substrate's properties independently
2Illumination intensity
If no opening part is formed on the upper substrate, then the substrate structure is complete and protective, but light loss occurs and central luminous intensity is reduced
Solution Approach 1:
An opening part is extracted or removed from the second substrate to create a window that directly exposes the LED chip. This opening allows light generated by the LED chip to escape directly upward without being blocked or absorbed by the substrate material, thereby reducing light loss and improving central luminous intensity
3Illumination intensity
If a double-sided reflection frame is not added, then the manufacturing process is simpler, but light distribution is inefficient and central luminous intensity is reduced
Solution Approach 1:
A double-sided reflection frame is added around the opening in the second substrate. This reflection frame has different optical properties than the surrounding substrate - it is designed to reflect light that would otherwise be lost at the edges back toward the opening, improving light distribution and central luminous intensity through localized optical enhancement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves central luminous intensity and minimizes light loss, resulting in more uniform and efficient light emission for improved display performance.
Implementation Method 1
forming an opening part having three open sides and a double-sided reflection frame on an upper substrate of the substrates
Data Source
AI summary
Provided are a light emitting apparatus and a light unit. The light emitting apparatus comprises a first substrate, a second substrate, and a light emitting device. The first substrate has a plurality of lead frames, and the second substrate has an opening part on the first substrate. The light emitting device is mounted on a portion of the first substrate that is below the opening part. The light unit comprises at least one light emitting apparatus and an optical member on a light emitting path of the light emitting apparatus.