LED Assembly Substrate with Redundant Electrodes for Defect-Tolerant Transfer
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Solution Overview
Problem
The existing methods for manufacturing large-screen display devices using semiconductor light emitting diodes face challenges such as low assembly rates and high repair times due to electrode defects and inefficient transfer processes, particularly in self-assembly technologies.
Innovation Solution
An assembly board is designed with a base portion, assembly electrodes, a dielectric layer, and barrier ribs, where voltage signals of the same polarity are applied to both ends of the electrodes to create an electric field, allowing semiconductor light emitting diodes to be seated at preset positions using both electric and magnetic fields, and voltage signals of different polarities are applied to adjacent electrodes to enhance assembly efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If self-assembly technology is used to transfer semiconductor light emitting diodes, then the assembly rate is improved, but the assembly process becomes sensitive to electrode defects causing repair time increases
Solution Approach 1:
The patent applies beforehand cushioning by creating redundant voltage supply paths through connection units that link adjacent electrodes. This redundant structure ensures that if one electrode fails, the voltage can still be supplied through alternative paths, preventing assembly defects before they occur and enabling continuous operation without repair interruptions
2Manufacturing precision
If voltage is applied to assembly electrodes to form electric fields, then semiconductor light emitting diodes can be positioned accurately, but resistance increases reducing efficiency
Solution Approach 1:
The patent divides the voltage supply system into multiple independent segments through connection units that electrically link adjacent electrodes. This segmentation allows each electrode to be controlled independently while sharing voltage supply paths, reducing overall resistance and energy loss while maintaining precise positioning capability through localized electric field control
3Manufacturing precision
If assembly electrodes are arranged at predetermined intervals, then semiconductor light emitting diodes can be assembled at preset positions, but the structure becomes complex
Solution Approach 1:
The patent merges adjacent electrodes through connection units that electrically connect them, creating a unified voltage supply network. This merging reduces the number of independent voltage control lines needed while maintaining the predetermined interval arrangement for precise positioning, thereby simplifying the overall structure without sacrificing assembly precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the assembly rate of semiconductor light emitting diodes, reduces resistance, and shortens repair times by ensuring that voltage can be supplied even if there are defects in the assembly electrodes, and allows for more efficient transfer to a final substrate.
Implementation Method 1
allowing semiconductor light emitting diodes to be seated at preset positions on the assembly board using an electric field and a magnetic field
Implementation Method 2
allowing semiconductor light emitting diodes to be seated at preset positions on the assembly board using an electric field and a magnetic field
Data Source
AI summary
Discussed is an assembly board including a base portion; a plurality of assembly electrodes extending in one direction and disposed on the base portion at predetermined intervals; a dielectric layer stacked on the base portion to cover the plurality of assembly electrodes; barrier ribs stacked on the dielectric layer and defining cells in which semiconductor light emitting diodes are seated at the predetermined intervals along an extending direction of the plurality of assembly electrodes so as to overlap a portion of the plurality of assembly electrodes; and a voltage applying unit connected to at least opposite ends of the plurality of assembly electrodes to apply one or more voltage signals to the plurality of assembly electrodes, wherein a voltage signal of the same polarity is applied to the plurality of assembly electrodes from the voltage applying unit connected to the opposite ends.