Recessed LED Substrate with Reflective Layers
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Solution Overview
Problem
Light emitting device packages face reduced light efficiency and color deviation due to light absorption and optical path differences between the light emitting part and phosphor, as well as inefficiencies in light emission and reflection.
Innovation Solution
A light emitting device package design featuring a semiconductor substrate with a multi-layer structure, including a groove and conductive layers to improve light reflection and reduce color deviation, where the light emitting part is mounted on a recessed surface with conductive layers for enhanced electrical and mechanical connections, and a phosphor is strategically positioned to minimize optical path differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the phosphor is placed close to the light emitting part for compact design, then the device size is reduced, but light efficiency is reduced due to light absorption by the light emitting part
Solution Approach 1:
The patent extracts the harmful function of the light emitting part by introducing a reflective layer that redirects absorbed light away from the light emitting part, preventing re-absorption and converting a harmful interaction into a beneficial reflection path
Solution Approach 2:
The reflective layer acts as an intermediary between the light emitting part and phosphor, managing the light paths and preventing direct absorption while maintaining close proximity for compact design
2Device complexity
If the phosphor is positioned close to the light emitting part, then device complexity is reduced, but color deviation occurs due to different optical paths
Solution Approach 1:
The patent applies different reflective properties to different regions of the package structure, with the reflective layer specifically positioned to manage light paths between the light emitting part and phosphor, creating localized optical control without complicating the overall structure
Solution Approach 2:
The reflective layer introduces a new dimensional aspect to light management by controlling light reflection angles and paths, allowing close positioning while maintaining optical precision through three-dimensional light path management
3Ease of manufacture
If a simple package structure is used, then ease of manufacture is improved, but light efficiency is reduced due to lack of light reflection management
Solution Approach 1:
The reflective layer enables the package structure to self-manage light paths, where the structure itself redirects light that would otherwise be lost, eliminating the need for complex external light management systems
Solution Approach 2:
The patent converts the harmful light absorption by the light emitting part into a beneficial reflection path by using the reflective layer to redirect light toward the phosphor, turning a loss mechanism into an efficiency-enhancing feature
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances light efficiency by reflecting unused light and reduces color deviation by optimizing the optical path, resulting in high-quality light emission.
Implementation Method 1
The design enhances light efficiency by reflecting unused light
Implementation Method 2
A light emitting device (LED) is a semiconductor device to convert a current into a light
Implementation Method 3
the light emitting part emits light having a first wavelength and the phosphor emit light having a second wavelength
Data Source
AI summary
A light emitting device package includes a substrate having a first cavity and a second cavity directly under the first cavity, a light emitting part on the second cavity, a first metal layer on an inner side surface of the substrate, a second metal layer on the inner side surface of the substrate, a third metal layer on a bottom surface of the substrate, the third metal layer electrically connected to the first metal layer by a first via hole, a fourth metal layer on the bottom surface of the substrate, the fourth metal layer electrically connected to the second metal layer by a second via hole, and a fifth metal layer on the bottom surface of the substrate, the fifth metal layer disposed between the first via hole and the second via hole.