Adhesive Layer Alignment for LED Substrate Transfer
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Solution Overview
Problem
The current manufacturing process of light emitting diodes (LEDs) faces challenges in maintaining alignment precision during the transfer of epitaxial structures due to thermal stress, which can cause shift phenomena and affect the accuracy of the device.
Innovation Solution
A method involving the formation of a first adhesive layer that encapsulates epitaxial structures and bonding pads on a growth substrate, followed by transfer to a second substrate using a second adhesive layer, ensuring multi-surface contact and maintaining fixed intervals between structures, thereby preventing inclination and ensuring precise alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the epitaxial structure is transferred from the growth substrate onto the permanent substrate or temporary substrate, then the device structure is completed, but a shift phenomenon occurs due to thermal stress affecting alignment precision
Solution Approach 1:
The patent introduces a first adhesive layer as an intermediary between the growth substrate and the permanent substrate. This adhesive layer acts as a mediator that maintains the positional relationship of the epitaxial structure during transfer, preventing shift caused by thermal stress between substrates with different thermal expansion coefficients
Solution Approach 2:
The first adhesive layer is formed on the growth substrate before the epitaxial structure is transferred to the permanent substrate. This preliminary action ensures that the adhesive layer is already in place to maintain alignment precision during the transfer process, preventing thermal stress-induced shifts
2Manufacturing precision
If a first adhesive layer is formed to encapsulate epitaxial structures and a first substrate is adhered, then alignment precision is maintained during transfer, but the device complexity increases
Solution Approach 1:
The patent segments the substrate transfer process into distinct stages: forming a first adhesive layer for initial positioning, transferring to a first substrate, then forming a second adhesive layer for final transfer to the permanent substrate. This segmentation allows each stage to be optimized independently for alignment precision while managing overall process complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively maintains alignment precision during substrate transfer, preventing inclination and ensuring accurate positioning of epitaxial structures, which enhances the overall manufacturing process of light emitting devices.
Implementation Method 1
A first adhesive layer is formed on the growth substrate. The first adhesive layer encapsulates the epitaxial structures and the bonding pads
Implementation Method 2
a method of removing the growth substrate includes a laser lift-off method
Data Source
AI summary
A method for manufacturing a light emitting device is provided. Multiple epitaxial structures and multiple bonding pads formed thereon are formed on a growth substrate. A first adhesive layer is formed on the growth substrate, wherein the first adhesive layer encapsulates the epitaxial structures and the bonding pads. A first substrate is provided on the first adhesive layer. The growth substrate is removed, so as to expose the epitaxial structures and the first adhesive layer. A second substrate and a second adhesive layer disposed thereon are provided, wherein the epitaxial structures are adhered on the second substrate by the second adhesive layer. The first adhesive layer and the first substrate are removed.